
OBSOLETE
SNAS122E – MAY 2001 – REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2)
Supply Voltage(3)
6.0V
Storage Temperature
65°C to +150°C
Input Voltage
0.3V to VDD +0.3V
Power Dissipation(4)(5)
Internally Limited
ESD Susceptibility(6)
2000V
ESD Susceptibility(7)
250V
Junction Temperature
150°C
Thermal Resistance
θJC (SOIC)
35°C/W
θJA (SOIC)
150°C/W
θJA (micro SMD)
220°C/W
θJC (VSSOP)
56°C/W
θJA (VSSOP)
190°C/W
θJA (WSON)
220°C/W
Soldering Information
See AN-1112 "DSBGA Wafer Level Chip Scale Package ".
See AN-1187 "Leadlesss Leadframe Package (LLP)".
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
If the product is in shutdown mode and VDD exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the ESD
protection circuits. If the source impedance limits the current to a max of 10 mA, then the part will be protected. If the part is enabled
when VDD is greater than 5.5V and less than 6.5V, no damage will occur, although operational life will be reduced. Operation above
6.5V with no current limit will result in permanent damage.
(4)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
(5)
Maximum power dissipation (PDMAX) in the device occurs at an output power level significantly below full output power. PDMAX can be
calculated using
Equation 1 shown in the Application section. It may also be obtained from the power dissipation graphs.
(6)
Human body model, 100 pF discharged through a 1.5 k
resistor.
(7)
Machine Model, 220 pF–240 pF discharged through all pins.
OPERATING RATINGS
Temperature Range
TMIN ≤ TA ≤ TMAX
40°C ≤ TA ≤ 85°C
Supply Voltage
2.2V
≤ VDD ≤ 5.5V
ELECTRICAL CHARACTERISTICS VDD = 5V
(1) (2) (3)
The following specifications apply for VDD = 5V, AV = 2, and 8 load unless otherwise specified. Limits apply for TA = 25°C.
LM4891
Units
Symbol
Parameter
Conditions
Typical
Limit
(Limits)
(4)
(5)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A
4
10
mA (max)
(1)
All voltages are measured with respect to the ground pin, unless otherwise specified.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3)
For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2A.
(4)
Typicals are measured at 25°C and represent the parametric normal.
(5)
Limits are specified to AOQL (Average Outgoing Quality Level).
4
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