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參數(shù)資料
| 型號(hào)： | LM4877IBP |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | Pressure Transducer, Series 19 mm, Compensated, Pressure Range: 0 psi to 3 psi, Gage, 1/4 BSPP, 10 Vdc excitation |
| 中文描述： | 1 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8 |
| 封裝： | MICRO, MO-211-BC, SMD-8 |
| 文件頁(yè)數(shù)： | 13/14頁(yè) |
| 文件大小： | 427K |
| 代理商： | LM4877IBP |
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Application Information
(Continued)
REFERENCE DESIGN BOARD and PCB LAYOUT
GUIDELINES
PCB Layout Guidelines
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
″
rule-of-thumb
″
recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the
digital power and ground trace paths from the analog power
and ground trace paths. Star trace routing techniques (bring-
ing individual traces back to a central point rather than daisy
chaining traces together in a serial manner) can have a ma-
jor impact on low level signal performance. Star trace routing
refers to using individual traces to feed power and ground to
each circuit or even device. This technique will take require
a greater amount of design time but will not increase the final
price of the board. The only extra parts required will be some
jumpers.
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link).A
″
Pi-filter
″
can be helpful
in minimizing High Frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digi-
tal and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signals traces
should be located as far away as possible from the analog
components and the analog circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces par-
allel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
DS101290-25
Figure 4
L
www.national.com
13
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4877IBPX | 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:1 Watt Audio Power Amplifier in micro SMD package with Shutdown Logic Low |
| LM4877ITP/NOPB | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4878 | 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:1 Watt Audio Power Amplifier in micro SMD package with Shutdown Logic Low |
| LM4878IBP | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4878IBP/NOPB | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
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