參數(shù)資料
型號(hào)： LM4852LQ
廠商： NATIONAL SEMICONDUCTOR CORP
元件分類(lèi)： 音頻／視頻放大
英文描述： Integrated Audio Amplifier System
中文描述： 1.5 W, 3 CHANNEL, AUDIO AMPLIFIER, QCC24
封裝： LLP-24
文件頁(yè)數(shù)： 15/21頁(yè)
文件大小： 860K
代理商： LM4852LQ
Application Information
TABLE 3. Volume Control
(Continued)
V4
V3
V2
V1
V0
Gain (dB)
G
-40.5
-39.0
-37.5
-36.0
-34.5
-33.0
-31.5
-30.0
-28.5
-27.0
-25.5
-24.0
-22.5
-21.0
-19.5
-18.0
-16.5
-15.0
-13.5
-12.0
-10.5
-9.0
-7.5
-6.0
-4.5
-3.0
-1.5
0.0
1.5
3.0
4.5
6.0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4852’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper area heatsink, copper traces, ground plane, and
finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.1W dissipation in a 8
load
at
≤
1% THD+N. This high power is achieved through careful
consideration of necessary thermal design. Failing to opti-
mize thermal design may compromise the LM4852’s high
power performance and activate unwanted, though neces-
sary, thermal shutdown protection.
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 6 (3 X 2) (LD) vias. The via diameter
should be 0.012in - 0.013in with a 1.27mm pitch. Ensure
efficient thermal conductivity by plugging and tenting the vias
with plating and solder mask, respectively.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2
(min) area is
necessary for 5V operation with a 4
load. Heatsink areas
not placed on the same PCB layer as the LM4852 should be
5in
2
(min) for the same supply voltage and load resistance.
The last two area recommendations apply for 25C ambient
temperature. Increase the area to compensate for ambient
temperatures above 25C. In all circumstances and under all
conditions, the junction temperature must be held below
L
www.national.com
15
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LM4852LQ/NOPB 功能描述:IC AMP AUDIO PWR 1.5W MONO 24LLP RoHS:是 類(lèi)別:集成電路 (IC) >> 線(xiàn)性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR)
LM4852LQBD 功能描述:BOARD EVALUATION LM4852LQ RoHS:否 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 過(guò)時(shí)/停產(chǎn)零件編號(hào) 系列:Boomer® 標(biāo)準(zhǔn)包裝:1 系列:- 傳感器類(lèi)型:CMOS 成像，彩色（RGB） 傳感范圍:WVGA 接口:I²C 靈敏度:60 fps 電源電壓:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相關(guān)產(chǎn)品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP
LM4853 制造商:NSC 制造商全稱(chēng):National Semiconductor 功能描述:Mono 1.5 W / Stereo 300mW Power Amplifier
LM4853LD 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
LM4853LD/NOPB 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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