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參數(shù)資料
| 型號： | LM4852LQ/NOPB |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.5 W, 3 CHANNEL, AUDIO AMPLIFIER, QCC24 |
| 封裝： | LLP-24 |
| 文件頁數(shù)： | 7/21頁 |
| 文件大小： | 860K |
| 代理商： | LM4852LQ/NOPB |
Application Information (Continued)
TABLE 3. Volume Control
V4
V3
V2
V1
V0
Gain (dB)
G
00000
-40.5
00001
-39.0
00010
-37.5
00011
-36.0
00100
-34.5
00101
-33.0
00110
-31.5
00111
-30.0
01000
-28.5
01001
-27.0
01010
-25.5
01011
-24.0
01100
-22.5
01101
-21.0
01110
-19.5
01111
-18.0
10000
-16.5
10001
-15.0
10010
-13.5
10011
-12.0
10100
-10.5
10101
-9.0
10110
-7.5
10111
-6.0
11000
-4.5
11001
-3.0
11010
-1.5
11011
0.0
11100
1.5
11101
3.0
11110
4.5
11111
6.0
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4852’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper area heatsink, copper traces, ground plane, and
finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.1W dissipation in a 8
load
at
≤ 1% THD+N. This high power is achieved through careful
consideration of necessary thermal design. Failing to opti-
mize thermal design may compromise the LM4852’s high
power performance and activate unwanted, though neces-
sary, thermal shutdown protection.
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 6 (3 X 2) (LD) vias. The via diameter
should be 0.012in - 0.013in with a 1.27mm pitch. Ensure
efficient thermal conductivity by plugging and tenting the vias
with plating and solder mask, respectively.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2 (min) area is
necessary for 5V operation with a 4
load. Heatsink areas
not placed on the same PCB layer as the LM4852 should be
5in
2 (min) for the same supply voltage and load resistance.
The last two area recommendations apply for 25C ambient
temperature. Increase the area to compensate for ambient
temperatures above 25C. In all circumstances and under all
conditions, the junction temperature must be held below
LM4852
www.national.com
15
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM4852ITL/NOPB | 1.1 W, 3 CHANNEL, AUDIO AMPLIFIER, PBGA18 |
| LM4854MT/NOPB | 0.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO14 |
| LM4854MTX/NOPB | 0.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO14 |
| LM4854LD/NOPB | 0.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO14 |
| LM4854LDX/NOPB | 0.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO14 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4853 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Mono 1.5 W / Stereo 300mW Power Amplifier |
| LM4853LD | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4853LD/NOPB | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4853MM | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4853MM/NOPB | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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