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參數(shù)資料
| 型號(hào)： | LM4843MHX/NOPB |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 音頻控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO20 |
| 封裝： | TSSOP-20 |
| 文件頁(yè)數(shù)： | 4/19頁(yè) |
| 文件大?。?/td> | 597K |
| 代理商： | LM4843MHX/NOPB |
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Application Information (Continued)
The LM4843 has two operational amplifiers per channel. The
maximum internal power dissipation per channel operating in
the bridge mode is four times that of a single-ended ampli-
fier. From Equation (3), assuming a 5V power supply and a
4
load, the maximum single channel power dissipation is
1.27W or 2.54W for stereo operation.
P
DMAX =4 * (VDD)
2/(2
π2R
L)
Bridge Mode
(3)
The LM4843’s power dissipation is twice that given by Equa-
tion (2) or Equation (3) when operating in the single-ended
mode or bridge mode, respectively. Twice the maximum
power dissipation point given by Equation (3) must not ex-
ceed the power dissipation given by Equation (4):
P
DMAX'=(TJMAX TA)/
θ
JA
(4)
The LM4843’s T
JMAX = 150C. In the LQ package soldered
to a DAP pad that expands to a copper area of 5in
2 on a
PCB, the LM4843’s
θ
JA is 20C/W. In the MH package
soldered to a DAP pad that expands to a copper area of 2in
2
on a PCB, the LM4843MH’s
θ
JA
is 41C/W. For the
LM4843MH package,
θ
JA = 80C/W. At any given ambient
temperature T
A, use Equation (4) to find the maximum inter-
nal power dissipation supported by the IC packaging. Rear-
ranging Equation (4) and substituting P
DMAX for PDMAX' re-
sults in Equation (5). This equation gives the maximum
ambient temperature that still allows maximum stereo power
dissipation without violating the LM4843’s maximum junction
temperature.
T
A =TJMAX – 2*PDMAX
θ
JA
(5)
For a typical application with a 5V power supply and an 4
load, the maximum ambient temperature that allows maxi-
mum stereo power dissipation without exceeding the maxi-
mum junction temperature is approximately 99C for the LQ
package and 45C for the MH package.
T
JMAX =PDMAX
θ
JA +TA
(6)
Equation (6) gives the maximum junction temperature
T
JMAX. If the result violates the LM4843’s 150C TJMAX,
reduce the maximum junction temperature by reducing the
power supply voltage or increasing the load resistance. Fur-
ther allowance should be made for increased ambient tem-
peratures.
The above examples assume that a device is a surface
mount part operating around the maximum power dissipation
point. Since internal power dissipation is a function of output
power, higher ambient temperatures are allowed as output
power or duty cycle decreases.
If the result of Equation (2) is greater than that of Equation
(3), then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. If these
measures are insufficient, a heat sink can be added to
reduce
θ
JA. The heat sink can be created using additional
copper area around the package, with connections to the
ground pin(s), supply pin and amplifier output pins. External,
solder attached MH heatsinks such as the Thermalloy
7106D can also improve power dissipation. When adding a
heat sink, the
θ
JA is the sum of
θ
JC,
θ
CS, and
θ
SA.(
θ
JC is the
junction-to-case thermal impedance,
θ
CS is the case-to-sink
thermal impedance, and
θ
SA is the sink-to-ambient thermal
impedance.) Refer to the Typical Performance Character-
istics curves for power dissipation information at lower out-
put power levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. Applications that employ a 5V regulator typically
use a 10 F in parallel with a 0.1 F filter capacitor to
stabilize the regulator’s output, reduce noise on the supply
line, and improve the supply’s transient response. However,
their presence does not eliminate the need for a local 1.0 F
tantalum bypass capacitance connected between the
LM4843’s supply pins and ground. Do not substitute a ce-
ramic capacitor for the tantalum. Doing so may cause oscil-
lation. Keep the length of leads and traces that connect
capacitors between the LM4843’s power supply pin and
ground as short as possible. Connecting a 1F capacitor,
C
B, between the BYPASS pin and ground improves the
internal bias voltage’s stability and the amplifier’s PSRR. The
PSRR improvements increase as the bypass pin capacitor
value increases. Too large a capacitor, however, increases
turn-on time and can compromise the amplifier’s click and
pop performance. The selection of bypass capacitor values,
especially C
B, depends on desired PSRR requirements,
click and pop performance (as explained in the following
section, Selecting Proper External Components), system
cost, and size constraints.
SELECTING PROPER EXTERNAL COMPONENTS
Optimizing the LM4843’s performance requires properly se-
lecting external components. Though the LM4843 operates
well when using external components with wide tolerances,
best performance is achieved by optimizing component val-
ues.
The LM4843 is unity-gain stable, giving a designer maximum
design flexibility. The gain should be set to no more than a
given application requires. This allows the amplifier to
achieve minimum THD+N and maximum signal-to-noise ra-
tio. These parameters are compromised as the closed-loop
gain increases. However, low gain circuits demand input
signals with greater voltage swings to achieve maximum
output power. Fortunately, many signal sources such as
audio CODECs have outputs of 1V
RMS (2.83VP-P). Please
refer to the Audio Power Amplifier Design section for more
information on selecting the proper gain.
Input Capacitor Value Selection
Amplifying the lowest audio frequencies requires a high
value input coupling capacitor (0.33F in Figure 2), but high
value capacitors can be expensive and may compromise
space efficiency in portable designs. In many cases, how-
ever, the speakers used in portable systems, whether inter-
nal or external, have little ability to reproduce signals below
150 Hz. Applications using speakers with this limited fre-
quency response reap little improvement by using a large
input capacitor.
Besides effecting system cost and size, the input coupling
capacitor has an affect on the LM4843’s click and pop per-
formance. When the supply voltage is first applied, a tran-
sient (pop) is created as the charge on the input capacitor
changes from zero to a quiescent state. The magnitude of
the pop is directly proportional to the input capacitor’s size.
LM4843
www.national.com
12
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4844 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Stereo 1.2W Audio Sub-system with 3D Enhancement |
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| LM4844TL/NOPB | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| LM4844TLEVAL | 功能描述:BOARD EVALUATION LM4844TL RoHS:否 類別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| LM4844TLX/NOPB | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
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