
Electrical Characteristics for Single-Ended Mode Operation
(Notes 7, 10)
The following specifications apply for V
DD = 5V and TA = 25C unless otherwise noted.
Symbol
Parameter
Conditions
LM4839
Units
(Limits)
Typical
(Note 14)
Limit
(Note 15)
P
O
Output Power
THD+N = 1.0%; f = 1kHz;
R
L =32
85
mW
THD+N = 10%;f=1 kHz; R
L =
32
95
mW
THD+N
Total Harmonic Distortion+Noise
V
OUT =1VRMS, f=1kHz, RL = 10k,
A
VD =1
0.065
%
PSRR
Power Supply Rejection Ratio
C
B = 1.0 F, f =120 Hz,
V
RIPPLE = 200 mVrms
58
dB
SNR
Signal to Noise Ratio
P
OUT =75 mW, R L =32, A-Wtd
Filter
102
dB
X
talk
Channel Separation
f=1kHz, C
B = 1.0 F
65
dB
Electrical Characteristics for Bridged Mode Operation
(Notes 7, 10)
The following specifications apply for V
DD = 5V and TA = 25C unless otherwise noted.
Symbol
Parameter
Conditions
LM4839
Units
(Limits)
Typical
(Note 14)
Limit
(Note 15)
V
OS
Output Offset Voltage
V
IN = 0V, No Load
±50
mV (max)
P
O
Output Power
THD+N= 1.0%; f=1kHz; R
L =3
(Note 8)
2.2
W
THD+N= 1.0%; f=1kHz; R
L =4
(Note 9)(Note 15)
2W
THD = 1.5% (max);f = 1 kHz;
R
L =8
1.1
1.0
W (min)
THD+N = 10%;f = 1 kHz; R
L =8
1.5
W
THD+N
Total Harmonic Distortion+Noise
P
O = 1W, 20 Hz< f < 20 kHz,
R
L =8,AVD =2
0.3
%
P
O = 340 mW, RL =32
1.0
%
PSRR
Power Supply Rejection Ratio
C
B = 1.0 F, f = 120 Hz,
V
RIPPLE = 200 mVrms; RL =8
74
dB
SNR
Signal to Noise Ratio
V
DD = 5V, POUT = 1.1W, RL =8,
A-Wtd Filter
93
dB
X
talk
Channel Separation
f=1kHz, C
B = 1.0 F
70
dB
Note 3: The
θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 2in 2 piece of 1 ounce printed circuit board copper.
Note 4: The
θJA given is for an MXA28A package whose exposed-DAP is soldered to a 2in2 piece of 1 ounce printed circuit board copper on a bottom side layer
through 21 8mil vias.
Note 5: The
θJA given is for an MXA28A package whose exposed-DAP is soldered to an exposed 1in 2 piece of 1 ounce printed circuit board copper.
Note 6: The
θJA given is for an MXA28A package whose exposed-DAP is not soldered to any copper.
Note 7: All voltages are measured with respect to the ground pins, unless otherwise specified. All specifications are tested using the typical application as shown
in Figure 2.
Note 8: When driving 3
loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board and forced-air cooled.
Note 9: When driving 4
loads from a 5V supply the LM4839MTE exposed DAP must be soldered to the circuit board.
Note 10:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 11: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θ JA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX =(TJMAX TA )/θJA. For the LM4839MT, TJMAX = 150C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 80C/W assuming the MTC28 package.
Note 12: Human body model, 100 pF discharged through a 1.5 k
resistor.
Note 13: Machine Model, 220 pF–240 pF discharged through all pins.
Note 14: Typicals are measured at 25C and represent the parametric norm.
LM4839
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