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參數(shù)資料
| 型號(hào)： | LM4752MDC |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
| 封裝： | DIE |
| 文件頁(yè)數(shù)： | 5/21頁(yè) |
| 文件大?。?/td> | 732K |
| 代理商： | LM4752MDC |
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Application Information (Continued)
TO-263 HEATSINK DESIGN EXAMPLES:
Example 1: (Stereo Single-Ended Output)
Given:
T
A=30C
T
J=150C
R
L=4
V
S=12V
θ
JC=2C/W
P
DMAX from PD vs PO Graph:
P
DMAX ≈ 3.7W
Calculating P
DMAX:
P
DMAX =VCC
2 /(
π2R
L) = (12V)
2 /
π2(4)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < [(T J TA)/PDMAX] θJC θCS
θ
SA < 120C / 3.7W 2.0C/W 0.2C/W = 30.2C/W
Therefore the recommendation is to use 1.5 x 1.5 square
inch of single-sided copper clad.
Example 2: (Stereo Single-Ended Output)
Given:
T
A=50C
T
J=150C
R
L=4
V
S=12V
θ
JC=2C/W
P
DMAX from PD vs PO Graph:
P
DMAX ≈ 3.7W
Calculating P
DMAX:
P
DMAX =VCC
2 /(
π2R
L) = (12V)
2 /(
π2(4)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < [(TJ TA)/PDMAX] θJC θCS
θ
SA < 100C / 3.7W 2.0C/W 0.2C/W = 24.8C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
Example 3: (Bridged Output)
Given:
T
A=50C
T
J=150C
R
L=8
V
S=12V
θ
JC=2C/W
Calculating P
DMAX:
P
DMAX = 4[VCC
2 /(2
π2R
L)] = 4(12V)
2 /(2
π2(8)) = 3.65W
Calculating Heatsink Thermal Resistance:
θ
SA < [(TJ TA)/PDMAX] θJC θCS
θ
SA < 100C / 3.7W 2.0C/W 0.2C/W = 24.8C/W
Therefore the recommendation is to use 2.0 x 2.0 square
inch of single-sided copper clad.
Layout and Ground Returns
Proper PC board layout is essential for good circuit perfor-
mance. When laying out a PC board for an audio power am-
plifer, particular attention must be paid to the routing of the
output signal ground returns relative to the input signal and
bias capacitor grounds. To prevent any ground loops, the
ground returns for the output signals should be routed sepa-
rately and brought together at the supply ground. The input
signal grounds and the bias capacitor ground line should
also be routed separately. The 0.1 F high frequency supply
bypass capacitor should be placed as close as possible to
the IC.
LM4752
www.national.com
13
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM4752MWC | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
| LM4752T/NOPB | 7 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM7 |
| LM4753T | 11.8 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM15 |
| LM4755MWC | 11 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
| LM4755MDC | 11 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4752T | 制造商:National Semiconductor Corporation 功能描述: 制造商:Texas Instruments 功能描述: |
| LM4752T/NOPB | 功能描述:IC AMP AUDIO PWR 11W AB TO220-7 RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4752T/NOPB | 制造商:Texas Instruments 功能描述:Audio Power Amplifier IC |
| LM4752TS | 功能描述:音頻放大器 RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| LM4752TS/NOPB | 功能描述:音頻放大器 STEREO 11W AUDIO PWR AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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