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參數(shù)資料
| 型號(hào)： | LM4700DWF |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 音頻／視頻放大 |
| 英文描述： | 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC |
| 封裝： | WAFER |
| 文件頁(yè)數(shù)： | 17/19頁(yè) |
| 文件大?。?/td> | 558K |
| 代理商： | LM4700DWF |
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External Components Description
Components
Functonal Description
1R
B
Prevents currents from entering the amplifier’s non-inverting input which may be passed through to the
load upon power down of the system due to the low input impedance of the circuitry when the
undervoltage circuitry is off. This phenomenon occurs when the supply voltages are below 1.5V.
2R
I
Inverting input resistance to provide AC gain in conjunction with R
F. Also creates a highpass filter with CI
at f
C = 1/(2πRICI).
3R
F
Feedback resistance to provide AC gain in conjunction with R
I.
4C
I (Note 15)
Feedback capacitor which ensures unity gain at DC.
5C
S
Provides power supply filtering and bypassing. Refer to the Supply Bypassing application section for
proper placement and selection of bypass capacitors.
6R
V
(Note 15)
Acts as a volume control by setting the input voltage level.
7R
IN
(Note 15)
Sets the amplifier’s input terminals DC bias point when C
IN is present in the circuit. Also works with CIN
to create a highpass filter at f
C = 1/(2πRINCIN). Refer to Figure 4.
8C
IN
(Note 15)
Input capacitor which blocks the input signal’s DC offsets from being passed onto the amplifier’s inputs.
9R
SN
(Note 15)
Works with C
SN to stabilize the output stage by creating a pole that reduces high frequency instabilities.
The pole is set at f
C = 1/(2πRSNCSN). Refer to Figure 4.
10
C
SN
(Note 15)
Works with R
SN to stabilize the output stage by creating a pole that reduces high frequency instabilities.
11
L (Note 15)
Provides high impedance at high frequencies so that R may decouple a highly capacitive load and
reduce the Q of the series resonant circuit. Also provides a low impedance at low frequencies to short
out R and pass audio signals to the load. Refer to
Figure 4.
12
R (Note 15)
13
R
A
Provides DC voltage biasing for the transistor Q1 in single supply operation.
14
C
A
Provides bias filtering for single supply operation.
15
R
INP
(Note 15)
Limits the voltage difference between the amplifier’s inputs for single supply operation. Refer to the
Clicks and Pops application section for a more detailed explanation of the function of R
INP.
16
R
BI
Provides input bias current for single supply operation. Refer to the Clicks and Pops application section
for a more detailed explanation of the function of R
BI.
17
R
E
Establishes a fixed DC current for the transistor Q1 in single supply operation. This resistor stabilizes the
half-supply point along with C
A.
Note 15: Optional components dependent upon specific design requirements.
www.national.com
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| LM4700MWC | 30 W, 1 CHANNEL, AUDIO AMPLIFIER, UUC |
| LM4700T | 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11 |
| LM4700TF/NOPB | 30 W, 1 CHANNEL, AUDIO AMPLIFIER, PZFM11 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4700T | 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:否 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Overture™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4700T/NOPB | 制造商:Texas Instruments 功能描述: |
| LM4700TF | 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11 |
| LM4700TF | 制造商:Texas Instruments 功能描述:IC AMP + MUTE 30W 4700 TO-220-11 |
| LM4700TF/NOPB | 功能描述:IC AMP AUDIO PWR 30W AB TO220-11 RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Overture™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類(lèi)型:H 類(lèi) 輸出類(lèi)型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點(diǎn):I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類(lèi)型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
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