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參數(shù)資料
| 型號(hào)： | LM4510SDX/NOPB |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類(lèi)： | 穩(wěn)壓器 |
| 英文描述： | LM4510 Synchronous Step-Up DC/DC Converter with True Shutdown Isolation; Package: LLP; No of Pins: 10; Qty per Container: 4500/Reel |
| 中文描述： | 1.8 A SWITCHING REGULATOR, 1200 kHz SWITCHING FREQ-MAX, DSO10 |
| 封裝： | 3 X 3 MM, 0.80 MM HEIGHT, LEAD FREE, LLP-10 |
| 文件頁(yè)數(shù)： | 6/16頁(yè) |
| 文件大?。?/td> | 2467K |
| 代理商： | LM4510SDX/NOPB |
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LAYOUT CONSIDERATIONS AND THERMAL
MANAGEMENT
30031096
FIGURE 7. Evaluation Board Layout
High frequency switching regulators require very careful lay-
out of components in order to get stable operation and low
noise. All components must be as close as possible to the
LM4510 device. Refer to Figure 7 as an example. Some ad-
ditional guidelines to be observed:
1. C
IN must be placed close to the device and connected di-
rectly from VIN to PGND pins. This reduces copper trace
resistance, which affects the input voltage ripple of the device.
For additional input voltage filtering, typically a 0.1 uF bypass
capacitor can be placed between VIN and AGND. This by-
pass capacitor should be placed near the device closer than
C
IN.
2. C
OUT must also be placed close to the device and connect-
ed directly from VOUT to PGND pins. Any copper trace
connections for the C
OUT capacitor can increase the series
resistance, which directly affects output voltage ripple and
makes noise during output voltage sensing.
3. All voltage-sensing resistors (R
F1, RF2) should be kept
close to the FB pin to minimize copper trace connections that
the voltage-sensing resistor should be connected directly to
the AGND pin.
4. Trace connections made to the inductor should be mini-
mized to reduce power dissipation, EMI radiation and in-
crease overall efficiency. Also poor trace connection increas-
es the ripple of SW.
5. C
S, CC1, CC2, RC must be placed close to the device and
connected to AGND.
6. The AGND pin should connect directly to the ground. Not
connecting the AGND pin directly, as close to the chip as
possible, may affect the performance of the LM4510 and limit
its current driving capability. AGND and PGND should be
separate planes and should be connected at a single point.
7. For better thermal performance, DAP should be connected
to ground, but cannot be used as the primary ground con-
nection. The PC board land may be modified to a "dog bone"
shape to reduce LLP thermal impedance. For detail informa-
tion, refer to Application Note AN-1187.
FLASH/TORCH APPLICATION
LM4510 can be configured to drive white LEDs for the flash
and torch functions. The flash/torch can be set up with the
circuit shown in Figure 8 by using the resistor R
T to determine
the current in Torch Mode and R
F to determine the current in
Flash Mode. The amount of current can be estimated using
the following equations:
30031028
FIGURE 8. Flash/Torch Circuit Using LM4510
www.national.com
14
LM4510
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