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參數(shù)資料
| 型號： | LM393TLX/NOPB |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | IC COMPARATOR DUAL 8USMD |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | 通用 |
| 元件數(shù)： | 2 |
| 輸出類型： | CMOS，DTL，ECL，MOS，開路集電極，TTL |
| 電壓 - 電源，單路/雙路(±)： | 2 V ~ 36 V，±1 V ~ 18 V |
| 電壓 - 輸入偏移（最小值）： | 5mV @ 30V |
| 電流 - 輸入偏壓（最小值）： | 0.25µA @ 5V |
| 電流 - 輸出（標(biāo)準(zhǔn)）： | 16mA @ 5V |
| 電流 - 靜態(tài)（最大值）： | 2.5mA |
| 傳輸延遲（最大）： | 700ns |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-WFBGA |
| 安裝類型： | 表面貼裝 |
| 包裝： | 剪切帶 (CT) |
| 其它名稱： | LM393TLX/NOPBCT |
SLCS005X – OCTOBER 1979 – REVISED JULY 2013
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
Supply voltage, VCC
(2)
36
V
Differential input voltage, VID
(3)
±36
V
Input voltage range (either input), VI
–0.3 to 36
V
Output voltage, VO
36
V
Output current, IO
20
mA
Duration of output short circuit to ground(4)
Unlimited
D package
97
DGK package
172
Package thermal impedance, junction to free air,
θJA
(5) (6)
P package
85
°C/W
PS package
95
PW package
149
FK package
5.61
Package thermal impedance, junction to case,
θJC
(7) (8)
°C/W
JG package
14.5
Operating virtual-junction temperature, TJ
150
°C
Case temperature for 60 s
FK package
260
°C
Lead temperature 1,6 mm (1/16 in) from case for 60 s
J package
300
°C
Storage temperature range, Tstg
–65 to 150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to network ground.
(3)
Differential voltages are at IN+ with respect to IN–.
(4)
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5)
Maximum power dissipation is a function of TJ (max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ (max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
(7)
Maximum power dissipation is a function of TJ (max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ (max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(8)
The package thermal impedance is calculated in accordance with MIL-STD-883.
Copyright 1979–2013, Texas Instruments Incorporated
3
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