Electrical Characteristics
(Notes 6, 7) Limits in standard typeface are for T
J
= +25C. Limits in
boldface
type apply over the full operating junction temperature range (40C
≤
= T
≤
+125C). Unless otherwise noted: specifications
apply to the LM3520. V
IN
= 3.6V, V(En)
>
1.0V, C
IN
= 10 μF (Note 8). (Continued)
Symbol
Parameter
Conditions
Min
22.2
21.5
2.3
2.35
Typ
23.2
22.5
2.4
2.45
Max
24.2
23.5
2.5
2.55
Units
OVP
Output Over-Voltage Protection
(Main & Sub Displays)
Input Under-Voltage Protection
ON Threshold
OFF Threshold
ON Threshold
OFF Threshold
V
OUT
= V
IN
, MAIN_EN =
SUB_EN = 0V
V
OUT
= 20V, SUB_EN = 0
V
UVP
V
I
Vout_main_leak
V
OUT
Leakage Current
0.1
nA
I
Vout_main_bias
V
OUT
Bias Current at No Load
60
150
μA
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
Enable signal must not be higher than Input voltage.
Note 3:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125
o
C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
x P
D-MAX
).
Note 4:
The Human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5:
Junction-to-ambient thermal resistance (
θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6mm x 76.2mm x 1.6mm. Thickness of the copper layers are 2oz/1oz/1oz/2oz. The
middle layer of the board is 60mm x 60mm. Ambient temperature in simulation is 22C, still air.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care
must be paid to thermal dissipation issues in board design.
Note 6:
All voltage is with respect toGND.
Note 7:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8:
C
IN
and C
OUT
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
Note 9:
Feedback current flows out of the Sub_ FB pin.
Note 10:
Current flows into the pin.
L
www.national.com
6