LM350
2
MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input–Output Voltage Differential
VI–VO
PD
TJ
Tstg
Tsolder
35
Vdc
Power Dissipation
Internally Limited
W
Operating Junction Temperature Range
–40 to +125
°
C
Storage Temperature Range
–65 to +150
°
C
Soldering Lead Temperature (10 seconds)
300
°
C
ELECTRICAL CHARACTERISTICS
(VI–VO = 5.0 V; IL = 1.5 A; TJ = Tlow to Thigh; Pmax [Note 1], unless otherwise noted.)
Characteristics
Figure
Symbol
Min
Typ
Max
Unit
Line Regulation (Note 2)
TA = 25
°
C, 3.0 V
≤
VI–VO
≤
35 V
1
Regline
–
0.0005
0.03
%/V
Load Regulation (Note 2)
TA = 25
°
C, 10 mA
≤
Il
≤
3.0 A
VO
≤
5.0 V
VO
≥
5.0 V
2
Regload
–
–
5.0
0.1
25
0.5
mV
% VO
Thermal Regulation, Pulse = 20 ms,
(TA = +25
°
C)
Regtherm
–
0.002
–
% VO/W
Adjustment Pin Current
3
IAdj
IAdj
–
50
100
μ
A
Adjustment Pin Current Change
3.0 V
≤
VI–VO
≤
35 V
10 mA
≤
IL
≤
3.0 A, PD
≤
Pmax
1,2
–
0.2
5.0
μ
A
Reference Voltage
3.0 V
≤
VI–VO
≤
35 V
10 mA
≤
IO
≤
3.0 A, PD
≤
Pmax
3
Vref
1.20
1.25
1.30
V
Line Regulation (Note 2)
3.0 V
≤
VI–VO
≤
35 V
1
Regline
–
0.02
0.07
%/V
Load Regulation (Note 2)
10 mA
≤
IL
≤
3.0 A
VO
≤
5.0 V
VO
≥
5.0 V
Temperature Stability (Tlow
≤
TJ
≤
Thigh)
Minimum Load Current to
Maintain Regulation (VI–VO = 35 V)
2
Regload
–
–
20
0.3
70
1.5
mV
% VO
3
TS
ILmin
–
1.0
–
% VO
mA
3
–
3.5
10
Maximum Output Current
VI–VO
≤
10 V, PD
≤
Pmax
VI–VO = 30 V, PD
≤
Pmax, TA = 25
°
C
3
Imax
3.0
0.25
4.5
1.0
–
–
A
RMS Noise, % of VO
TA= 25
°
C, 10 Hz
≤
f
≤
10 kHz
N
–
0.003
–
% VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 3)
Without CAdj
CAdj = 10
μ
F
4
RR
–
66
65
80
–
–
dB
Long Term Stability, TJ = Thigh (Note 4)
TA= 25
°
C for Endpoint Measurements
3
S
–
0.3
1.0
%/1.0 k
Hrs.
Thermal Resistance, Junction–to–Case
Peak (Note 5)
Average (Note 6)
R
θ
JC
–
–
2.3
–
–
1.5
°
C/W
NOTES:
1.Tlow to Thigh = 0
°
to +125
°
C; Pmax = 25 W for LM350T; Tlow to Thigh = –40
°
to +125
°
C; Pmax = 25 W for LM350BT
2.Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately.
Pulse testing with low duty cycle is used.
3.CAdj, when used, is connected between the adjustment pin and ground.
4.Since Long–Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability
from lot to lot.
5.Thermal Resistance evaluated measuring the hottest temperature on the die using an infrared scanner. This method of evaluation yields very
accurate thermal resistance values which are conservative when compared to the other measurement techniques.
6.The average die temperature is used to derive the value of thermal resistance junction to case (average).