Electrical Characteristics
(Continued)
Specifications in standard type face are for T
= 25C and those in
boldface type
apply over the full
Operating Temperature
Range (T
J
= 40C to +125C)
. Unless otherwise specified V
IN
=2.7V and specification apply to both LM3500-16 and LM3500-
21.
Symbol
Parameter
Conditions
Min
(Note 7)
Typ
(Note 8)
18
9
0.1
0.01
Max
(Note 7)
30
16
Units
I
SD
SHDN Pin Current (Note 10)
SHDN = 5.5V
SHDN = 2.7V
SHDN = GND
V
SW
= 15V
μA
I
L
Switch Leakage Current
(LM3500-16)
Switch Leakage Current
(LM3500-21)
Input Undervoltage Lockout
0.5
μA
V
SW
= 20V
0.01
2.0
UVP
ON Threshold
OFF Threshold
ON Threshold
OFF Threshold
ON Threshold
OFF Threshold
V
OUT
= 15V, SHDN = V
IN
2.4
2.3
15
14
20
19
2.5
2.4
15.5
14.6
20.5
19.5
2.6
2.5
16
15
21
20
V
OVP
Output Overvoltage
Protection (LM3500-16)
V
Output Overvoltage
Protection (LM3500-21)
I
Vout
V
OUT
Bias Current
(LM3500-16)
V
OUT
Bias Current
(LM3500-21)
PMOS Switch Leakage
Current (LM3500-16)
PMOS Switch Leakage
Current (LM3500-21)
SHDN Low
SHDN High
260
400
μA
V
OUT
= 20V, SHDN = V
IN
300
460
I
VL
V
OUT
= 15V, V
SW
= 0V
0.01
3
μA
V
OUT
= 20V, V
SW
= 0V
0.01
3
SHDN
Threshold
0.65
0.65
0.3
V
1.1
Note 1:
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to
be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2:
This condition applies if V
IN
<
V
OUT
. If V
IN
>
V
OUT
, a voltage greater than V
IN
+ 0.3V should not be applied to the V
OUT
or V
SW
pins.
Note 3:
For more detailed soldering information and specifications, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip
Scale Package (AN-1112), available at www.national.com.
Note 4:
The human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 5:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125
o
C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
x P
D-MAX
).
Note 6:
Junction-to-ambient thermal resistance (
θ
) is highly application and board-layout dependent. The 75
o
C/W figure provided was measured on a 4-layer test
board conforming to JEDEC standards. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues when
designing the board layout.
Note 7:
All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production
tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical
Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 8:
Typical numbers are at 25C and represent the most likely norm.
Note 9:
Feedback current flows out of the pin.
Note 10:
Current flows into the pin.
L
www.national.com
5