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參數(shù)資料
| 型號： | LM2937IMPX-5.0 |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| 中文描述： | 5 V FIXED POSITIVE LDO REGULATOR, 1 V DROPOUT, PDSO4 |
| 封裝： | PLASTIC, SOT-223, 4 PIN |
| 文件頁數(shù)： | 7/11頁 |
| 文件大?。?/td> | 300K |
| 代理商： | LM2937IMPX-5.0 |
θ
is specified numerically by the heatsink manufacturer
in the catalog, or shown in a curve that plots temperature rise
vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a
copper plane on the PCB and the PCB itself as a heatsink.
To optimize the heat sinking ability of the plane and PCB,
solder the tab of the package to the plane.
Figure 3shows for the TO-263 the measured values of
θ
for different copper area sizes using a typical PCB with 1
ounce copper and no solder mask over the copper area used
for heatsinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. It should also
be observed that the minimum value of
θ
(JA)
for the TO-263
package mounted to a PCB is 32C/W.
As a design aid, Figure 4 shows the maximum allowable
power dissipation compared to ambient temperature for the
TO-263 device (assuming
θ
is 35C/W and the maxi-
mum junction temperature is 125C).
Figure 5 and Figure 6 show the information for the SOT-223
package. Figure 6 assumes a
θ
of 74C/W for 1 ounce
copper and 51C/W for 2 ounce copper and a maximum
junction temperature of 125C.
Please see AN1028 for power enhancement techniques to
be used with the SOT-223 package.
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave solder-
ing to attach the small SOT-223 package to a printed circuit
board. The excessive temperatures involved may cause
package cracking.
Either vapor phase or infrared reflow techniques are pre-
ferred soldering attachment methods for the SOT-223 pack-
age.
DS100113-20
FIGURE 3.
θ
(JA)
vs Copper (1 ounce) Area for the
TO-263 Package
DS100113-21
FIGURE 4. Maximum Power Dissipation vs T
AMB
for
the TO-263 Package
DS100113-22
FIGURE 5.
θ
(JA)
vs Copper (2 ounce) Area for the
SOT-223 Package
DS100113-23
FIGURE 6. Maximum Power Dissipation vs T
AMB
for
the SOT-223 Package
7
www.national.com
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參數(shù)描述 |
|---|---|
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