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參數(shù)資料
| 型號(hào)： | LM27961 |
| 廠(chǎng)商： | National Semiconductor Corporation |
| 元件分類(lèi)： | LED驅(qū)動(dòng)器 |
| 英文描述： | Dual-Display White LED Driver with 3/2x Switched Capacitor Boost |
| 中文描述： | 雙顯示器白光LED驅(qū)動(dòng)3/2x開(kāi)關(guān)電容升壓 |
| 文件頁(yè)數(shù)： | 4/13頁(yè) |
| 文件大?。?/td> | 711K |
| 代理商： | LM27961 |
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Electrical Characteristics
(Notes 2, 7) (Continued)
Limits in standard typeface are for T
= 25C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: V
= 3.6V; V
DxA
= 0.6V; V
DxB
= 3.6V; ENA = 1.5V and ENB = GND, or ENA = GND and ENB =
1.5V; R
SETA
= R
SETB
= 8.35k
; C
, C
, and C
= 1μF. Specifications related to output current(s) and current setting
pins (I
Dxx
SETx
) apply to both Group A and Group B. (Note 8)
Symbol
Parameter
R
OUT
Charge Pump Output Resistance
(Note 10)
V
HR
Current Source Headroom
Voltage Requirement (Note 11)
R
SET
= 8.35k
(I
Dxx
(nom)
≈
15mA)
f
SW
Switching Frequency
3.0V
≤
V
IN
≤
4.2V
t
START
Start-up Time
I
Dx
= 90% steady state
1.5x/1x
Charge pump gain cross-over:
Gain = 1.5 when V
IN
is below
threshold. Gain = 1 when V
IN
is
above threshold.
Logic Pin Specifications: EN, ENA, ENB
V
IL
Input Logic Low
2.7V
≤
V
IN
≤
5.5V
V
IH
Input Logic High
2.7V
≤
V
IN
≤
5.5V
I
LEAK
Input Leakage Current
V
ENx
= 0V
V
ENx
= 3V (Note 12)
Condition
Min
Typ
2.7
Max
Units
V
IN
= 3.0V
I
Dxx
= 95% X I
Dxx
(nom)
320
mV
375
500
350
4.75
625
kHz
μs
V
1.5x to 1x Threshold
1x to 1.5x Threshold
4.55
V
0
0.5
V
IN
V
V
μA
1.1
0.1
10
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 160C (typ.) and disengages at T
J
=
120C (typ.). The thermal shutdown function is guaranteed by design.
Note 4:
The Human body model is a 100pF capacitor discharged through a 1.5k
resistor into each pin. The machine model is a 200pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
x P
D-MAX
).
Note 6:
Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 7:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8:
C
IN
, C
POUT
, C
1
, and C
2
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
Note 9:
For the two groups of outputs on a part (GroupAand Group B), the following are determined: the maximum output current in the group (MAX), the minimum
output current in the group (MIN), and the average output current of the group (AVG). For each group, two matching numbers are calculated: (MAX-AVG)/AVG and
(AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the group. The matching figure for a given part is considered to
be the highest matching figure of the two groups. The typical specification provided is the most likely norm of the matching figure for all parts.
Note 10:
Output resistance (R
OUT
) models all voltage losses in the charge pump. R
can be used to estimate the voltage at the charge pump output (P
):
V
= (1.5 x V
) – (R
x I
). In the equation, I
is the total output current: the sum of all active Dxx output currents and all current drawn from P
OUT
. The
equation applies when the charge pump is operating with a gain of 3/2 (V
IN
≤
4.75V typ.).
Note 11:
Headroom voltage: V
HR
= V
Pout
– V
LEDx
. If headroom voltage requirement is not met, LED current regulation will be compromised.
Note 12:
There is a 300k
(typ.) pull-down resistor connected internally between each enable pin (ENA, ENB) and GND.
L
www.national.com
4
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