Application Hints
(Continued)
OPTIMIZING TRANSIENT RESPONSE
Referring to
Figure 9
, there are three components (R1, R2
and L1) that can be adjusted to optimize the transient re-
sponse of the application circuit. Increasing the values of R1
and R2 will slow the circuit down while decreasing over-
shoot. Increasing the value of L1 will speed up the circuit as
well as increase overshoot. It is very important to use induc-
tors with very high self-resonant frequencies, preferably
above 300 MHz. Ferrite core inductors from J.W. Miller
Magnetics (part
#
78FR56M) were used for optimizing the
performance of the device in the NSC application board. The
values shown in
Figure 9
can be used as a good starting
point for the evaluation of the LM2436. The NSC demo
board also has a position open to add a resistor in parallel
with L1. This resistor can be used to help control overshoot.
Using variable resistors for R1 and the parallel resistor will
simplify finding the values needed for optimum performance
in a given application. Once the optimum values are deter-
mined the variable resistors can be replaced with fixed val-
ues.
EFFECT OF LOAD CAPACITANCE
Figure 8
shows the effect of increased load capacitance on
the speed of the device. This demonstrates the importance
of knowing the load capacitance in the application.
EFFECT OF OFFSET
Figure 7
shows the variation in rise and fall times when the
output offset of the device is varied from 40 to 50 V
. The
rise time shows a maximum variation relative to the center
data point (45 V
) less than 5%. The fall time shows a
variation less than 4% relative to the center data point.
THERMAL CONSIDERATIONS
Figure 4
shows the performance of the LM2436 in the test
circuit shown in
Figure 2
as a function of case temperature.
The figure shows that the rise time of the LM2436 increases
by approximately 8% as the case temperature increases
from 40C to 100C. This corresponds to a speed degrada-
tion of 1.3% for every 10C rise in case temperature.The fall
time increases by approximately 4% as the case tempera-
ture increases from 40C to 100C.
Figure 6
shows the maximum power dissipation of the
LM2436 vs. Frequency when all three channels of the device
are driving an 8 pF load with a 40 V
p-p
alternating one pixel
on, one pixel off signal. The graph assumes a 72% active
time (device operating at the specified frequency) which is
typical in a monitor application. The other 28% of the time
the device is assumed to be sitting at the black level (65V in
this case). This graph gives the designer the information
needed to determine the heat sink requirement for his appli-
cation. The designer should note that if the load capacitance
is increased the AC component of the total power dissipation
will also increase.
The LM2436 case temperature must be maintained below
100C. If the maximum expected ambient temperature inside
the monitor is 70C and the power dissipation is 4.2W (from
Figure 6
, 50 MHz max video frequency) then a maximum
heat sink thermal resistance can be calculated:
This example assumes a capacitive load of 8 pF and no
resistive load.
TYPICAL APPLICATION
A typical application of the LM2436 is shown in
Figure 11
.
Used in conjunction with an LM1279, a complete video
channel from monitor input to CRT cathode can be achieved.
Performance is ideal for 1024 x 768 resolution displays with
pixel clock frequencies up to 100 MHz.
Figure 11
is the
schematic for the NSC demonstration board that can be
used to evaluate the LM1279/2436 combination in a monitor,
and
Figure 10
shows the response at the red cathode for this
application. The input video rise time is 3.2ns, and the peak-
ing component values are those recommended in
Figure 11
.
Table 1
shows the typical cathode response of all three
channels.
20043510
FIGURE 9. One Channel of the LM2436 with the Recommended Application Circuit
L
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