參數(shù)資料
型號(hào)： LM12H458CIVX
英文描述： Single-Ended Data Acquisition System
中文描述： 單端數(shù)據(jù)采集系統(tǒng)
文件頁(yè)數(shù)： 3/9頁(yè)
文件大小： 128K
代理商： LM12H458CIVX
LM124, LM124A, LM224, LM224A
LM324, LM324A, LM324Y, LM2902, LM2902Q
QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS066E– SEPTEMBER 1975 – REVISED FEBRUARY1997
3–3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LM324Y chip information
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
1IN+
1IN–
2OUT
3IN+
1OUT
2IN+
2IN–
3OUT
4IN+
VCC+
3IN–
4OUT
4IN–
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
(2)
(7)
(10)
(9)
(14)
(1)
(5)
(6)
(8)
(12)
(13)
62
65
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(11)
(4)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LM12H458CIVX/NOPB 功能描述:IC ACQUISITION SYS 12BIT 44-PLCC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - ADCs/DAC - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 類型:數(shù)據(jù)采集系統(tǒng)（DAS） 分辨率（位）:16 b 采樣率（每秒）:21.94k 數(shù)據(jù)接口:MICROWIRE?，QSPI?，串行，SPI? 電壓電源:模擬和數(shù)字 電源電壓:1.8 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:40-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:40-TQFN-EP（6x6） 包裝:托盤
LM12H458CMEL/883 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Single-Ended Data Acquisition System
LM12H458MEL/883 制造商:NSC 制造商全稱:National Semiconductor 功能描述:12-Bit Sign Data Acquisition System with Self-Calibration
LM12H458MW/883 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Single-Ended Data Acquisition System
LM12L438CIV 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Sign Data Acquisition System with Serial I/O and Self-Calibration
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