參數(shù)資料
型號: LM124AW
廠商: Texas Instruments, Inc.
元件分類: 運(yùn)算放大器
英文描述: QUADRUPLE OPERATIONAL AMPLIFIERS
中文描述: 四路運(yùn)算放大器
文件頁數(shù): 3/9頁
文件大?。?/td> 128K
代理商: LM124AW
LM124, LM124A, LM224, LM224A
LM324, LM324A, LM324Y, LM2902, LM2902Q
QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS066E– SEPTEMBER 1975 – REVISED FEBRUARY1997
3–3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LM324Y chip information
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
1IN+
1IN–
2OUT
3IN+
1OUT
2IN+
2IN–
3OUT
4IN+
VCC+
3IN–
4OUT
4IN–
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
(2)
(7)
(10)
(9)
(14)
(1)
(5)
(6)
(8)
(12)
(13)
62
65
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(11)
(4)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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