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參數(shù)資料
| 型號(hào)： | LM124 |
| 廠商： | 意法半導(dǎo)體 |
| 元件分類(lèi)： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | LOW POWER QUAD OPERATIONAL AMPLIFIERS |
| 中文描述： | 低功耗四運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 3/9頁(yè) |
| 文件大小： | 128K |
| 代理商： | LM124 |
LM124, LM124A, LM224, LM224A
LM324, LM324A, LM324Y, LM2902, LM2902Q
QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS066E– SEPTEMBER 1975 – REVISED FEBRUARY1997
3–3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LM324Y chip information
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
1IN+
1IN–
2OUT
3IN+
1OUT
2IN+
2IN–
3OUT
4IN+
VCC+
3IN–
4OUT
4IN–
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
(2)
(7)
(10)
(9)
(14)
(1)
(5)
(6)
(8)
(12)
(13)
62
65
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(11)
(4)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM124P | LOW POWER QUAD OPERATIONAL AMPLIFIERS |
| LM124N | LOW POWER QUAD OPERATIONAL AMPLIFIERS |
| LM124D | LOW POWER QUAD OPERATIONAL AMPLIFIERS |
| LM124N | Low power quad op amps |
| LM124F | Low power quad op amps |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM124 MD8 | 制造商:Texas Instruments 功能描述:UNPACKAGED DIE LOW POWER QUAD OPERATIONAL AMPLIFIER - Gel-pak, waffle pack, wafer, diced wafer on film |
| LM124/BCA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Voltage-Feedback Operational Amplifier |
| LM124/BDA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Voltage-Feedback Operational Amplifier |
| LM124_05 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:Low Power Quad Operational Amplifiers |
| LM124_06 | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:Low power quad operational amplifiers |
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