參數(shù)資料
型號: LM111J
廠商: Texas Instruments, Inc.
英文描述: DIFFERENTIAL COMPARATORS WITH STROBES
中文描述: 選通差分比較器
文件頁數(shù): 3/16頁
文件大?。?/td> 274K
代理商: LM111J
LM111, LM211, LM311, LM311Y
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LM311Y chip information
This chip, when properly assembled, displays characteristics similar to the LM311. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJ max = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
BAL/STRB
COL
OUT
IN–
IN+
BALANCE
EMIT
OUT
(5)
(2)
(3)
(6)
(8)
(4)
VCC+
VCC–
(7)
(1)
+
62
50
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
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