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參數(shù)資料
| 型號： | LM111 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | Voltage Comparator |
| 中文描述： | 電壓比較器 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大小： | 274K |
| 代理商： | LM111 |
LM111, LM211, LM311, LM311Y
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
LM311Y chip information
This chip, when properly assembled, displays characteristics similar to the LM311. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJ max = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
BAL/STRB
COL
OUT
IN–
IN+
BALANCE
EMIT
OUT
(5)
(2)
(3)
(6)
(8)
(4)
VCC+
VCC–
(7)
(1)
+
–
62
50
(1)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM1131 | DUAL DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
| LM1131AN | DUAL DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
| LM1131CN | DUAL DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
| LM1131CM | DUAL DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
| LM1131BN | DUAL DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM111 MD8 | 制造商:Texas Instruments 功能描述:VOLTAGE COMPARATOR - Gel-pak, waffle pack, wafer, diced wafer on film |
| LM111/B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Voltage Comparator |
| LM111_1003 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIFFERENTIAL COMPARATORS WITH STROBES |
| LM-11-10000 | 制造商:TE Connectivity 功能描述: |
| LM1112 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:DOLBY B-TYPE NOISE REDUCTION PROCESSOR |
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