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  • 參數(shù)資料
    型號(hào): LH28F008SCB-TL12
    英文描述: x8 Flash EEPROM
    中文描述: x8閃存EEPROM的
    文件頁數(shù): 9/56頁
    文件大?。?/td> 373K
    代理商: LH28F008SCB-TL12
    3 BUS OPERATION
    The local CPU reads and writes flash memory in-
    system. All bus cycles to or from the flash memory
    conform to standard microprocessor bus cycles.
    3.1
    Information can be read from any block, identifier
    codes, query structure, or status register
    independent of the V
    PP
    voltage. RP# must be at
    V
    IH
    .
    Read
    The first task is to write the appropriate read mode
    command (Read Array, Read Identifier Codes,
    Query or Read Status Register) to the CUI. Upon
    initial device power-up or after exit from deep
    power-down mode, the device automatically resets
    to read array mode. Five control pins dictate the
    data flow in and out of the component : CE#
    (CE
    0
    #, CE
    1
    #), OE#, WE#, RP# and WP#. CE
    0
    #,
    CE
    1
    # and OE# must be driven active to obtain data
    at the outputs. CE
    0
    # and CE
    1
    # are the device
    selection control, and when active enables the
    selected memory device. OE# is the data output
    (DQ
    0
    -DQ
    15
    ) control and when active drives the
    selected memory data onto the I/O bus. WE# and
    RP# must be at V
    IH
    .
    Fig. 15
    and
    Fig. 16
    , illustrate
    a read cycle.
    3.2
    With OE# at a logic-high level (V
    IH
    ), the device
    outputs are disabled. Output pins DQ
    0
    -DQ
    15
    are
    placed in a high-impedance state.
    Output Disable
    3.3
    Either CE
    0
    # or CE
    1
    # at a logic-high level (V
    IH
    )
    places the device in standby mode which
    substantially reduces device power consumption.
    DQ
    0
    -DQ
    15
    outputs are placed in a high-impedance
    state independent of OE#. If deselected during
    block erase, full chip erase, (multi) word/byte write
    and block lock-bit configuration, the device
    continues functioning, and consuming active power
    until the operation completes.
    Standby
    3.4
    RP# at V
    IL
    initiates the deep power-down mode.
    Deep Power-Down
    In read modes, RP#-low deselects the memory,
    places output drivers in a high-impedance state and
    turns off all internal circuits. RP# must be held low
    for a minimum of 100 ns. Time t
    PHQV
    is required
    after return from power-down until initial memory
    access outputs are valid. After this wake-up
    interval, normal operation is restored. The CUI is
    reset to read array mode and status register is set
    to 80H.
    During block erase, full chip erase, (multi) word/byte
    write or block lock-bit configuration modes, RP#-low
    will abort the operation. STS remains low until the
    reset operation is complete. Memory contents being
    altered are no longer valid; the data may be
    partially erased or written. Time t
    PHWL
    is required
    after RP# goes to logic-high (V
    IH
    ) before another
    command can be written.
    As with any automated device, it is important to
    assert RP# during system reset. When the system
    comes out of reset, it expects to read from the flash
    memory. Automated flash memories provide status
    information when accessed during block erase, full
    chip erase, (multi) word/byte write and block lock-bit
    configuration. If a CPU reset occurs with no flash
    memory reset, proper CPU initialization may not
    occur because the flash memory may be providing
    status information instead of array data. SHARP’s
    flash memories allow proper CPU initialization
    following a system reset through the use of the
    RP# input. In this application, RP# is controlled by
    the same RESET# signal that resets the system
    CPU.
    LH28F160S5-L/S5H-L
    - 9 -
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