參數(shù)資料
型號(hào): LG1627BXC
英文描述: LG1627BXC Clocked Laser Driver
中文描述: LG1627BXC時(shí)鐘激光驅(qū)動(dòng)器
文件頁數(shù): 8/10頁
文件大?。?/td> 921K
代理商: LG1627BXC
8
Agere Systems Inc.
Data Sheet
May 2001
LG1627BXC Clocked Laser Driver
Outline Diagram
5-6555(F).a
Assembly Notes:
Standoff specifications apply to package prior to solder dipping of leads and package base.
During board assembly, use back lighting to silhouette the package. This will eliminate reflection problems with the solder on the
bottom of the package.
Lead space tolerance should be set to ±0.012”.
Board solder pattern for the package base should not exceed 50% of the package base area.
Insertion pressure should not exceed 125 grams.
Ordering Information
Device Code
Package
Temperature
Comcode
(Ordering Number)
108325754
LG1627BXC
24-pin hermetic small outline
0 °C to 70 °C
1
1
0 — 0.004
0.082
0.005
0.092
0.045
0.035
0.030
0.012
0.280
0.465
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