參數(shù)資料
型號: LFX200B-3F900I
廠商: Lattice Semiconductor Corporation
英文描述: The ispXPGA architecture
中文描述: 在ispXPGA架構(gòu)
文件頁數(shù): 24/89頁
文件大?。?/td> 941K
代理商: LFX200B-3F900I
Lattice Semiconductor
ispXPGA Family Data Sheet
24
sysIO DC Electrical Characteristics
Over Recommended Operating Conditions
Standard
V
IL
V
IH
V
OL
Max. (V)
V
OH
Min. (V)
I
OL
(mA)
20, 16, 12,
8, 5.33, 4
I
OH
(mA)
-20, -16,-12,
-8, -5.33, -4
Min. (V)
Max. (V)
Min. (V)
Max. (V)
LVCMOS 3.3
-0.3
0.8
2.0
3.6
0.4
V
CCO
- 0.4
0.2
V
CCO
- 0.2
0.1
-0.1
LVCMOS 2.5
-0.3
0.7
1.7
3.6
0.4
V
CCO
- 0.4
16, 12, 8,
5.33, 4
-16, -12, -8,
-5.33, -4
0.2
V
CCO
- 0.2
0.1
-0.1
LVCMOS 1.8
1
-0.3
0.68
3
1.07
3
3.6
0.4
V
CCO
- 0.4
12, 8
1
, 5.33,
4
-12, -8
1
,
-5.33, -4
0.35V
CC
0.65V
CC
0.2
V
CCO
- 0.2
0.1
-0.1
LVTTL
-0.3
0.8
2.0
3.6
0.4
V
CCO
- 0.4
20, 16, 12,
8, 5.33, 4
-20, -16,-12,
-8, -5.33, -4
0.2
V
CCO
- 0.2
0.1
-0.1
PCI 3.3
-0.3
1.08
3
1.5
3
3.6
0.1 V
CCO
0.9 V
CCO
1.5
-0.5
0.3V
CCO
1.08
3
0.5 V
CCO
1.5
3
AGP-1X
-0.3
3.6
0.1 V
CCO
0.9 V
CCO
1.5
-0.5
0.3 V
CCO
V
REF
- 0.2
V
REF
- 0.2
V
REF
- 0.18 V
REF
+ 0.18
V
REF
- 0.18 V
REF
+ 0.18
V
REF
- 0.2
V
REF
- 0.2
V
REF
- 0.1
V
REF
- 0.1
V
REF
- 0.2
0.5 V
CCO
V
REF
+ 0.2
V
REF
+ 0.2
SSTL 3 Class I
-0.3
3.6
0.7
V
CCO
- 1.1
V
CCO
- 0.9
V
CCO
- 0.62
V
CCO
- 0.43
V
REF
+ 0.4
V
REF
+ 0.4
V
CCO
- 0.4
V
CCO
- 0.4
N/A
8
-8
SSTL 3 Class II
-0.3
3.6
0.5
16
-16
SSTL 2 Class I
-0.3
3.6
0.54
7.6
-7.6
SSTL 2 Class II
-0.3
3.6
0.35
15.2
-15.2
CTT 3.3
-0.3
V
REF
+ 0.2
V
REF
+ 0.2
V
REF
+ 0.1
V
REF
+ 0.1
V
REF
+ 0.2
3.6
V
REF
- 0.4
V
REF
- 0.4
0.4
8
-8
CTT 2.5
-0.3
3.6
8
-8
HSTL Class I
-0.3
3.6
8
-8
HSTL Class III
-0.3
3.6
0.4
24
-8
GTL+
-0.3
3.6
0.6
36
N/A
1. Design tool default setting.
2. The average DC current drawn by I/Os between adjacent bank GND connections, or between the last GND in an I/O bank and the end of
the I/O bank, as shown in the logic signals connection table, shall not exceed n*8mA. Where n is the number of I/Os between bank GND
connections or between the last GND in a bank and the end of a bank
3. Applicable for ispXPGA V/B devices.
相關(guān)PDF資料
PDF描述
LFX1200B-03F900C The ispXPGA architecture
LFX200C-3F900C The ispXPGA architecture
LFX200C-3F900I The ispXPGA architecture
LFX500C-4F900I The ispXPGA architecture
LFX1200C-03F900C Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
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