參數(shù)資料
型號(hào)： LFX1200C-03F900C
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
中文描述： FPGA, 3844 CLBS, 1250000 GATES, PBGA900
封裝： FPBGA-900
文件頁(yè)數(shù)： 79/89頁(yè)
文件大?。?/td> 941K
代理商： LFX1200C-03F900C
Lattice Semiconductor
ispXPGA Family Data Sheet
79
AJ12
BK2_IO43
-
83N
BK2_IO23
-
53N
AD13
BK2_IO44
-
84P
BK2_IO24
-
54P
AE13
BK2_IO45
-
84N
BK2_IO25
-
54N
AK13
BK2_IO46
-
85P
BK2_IO26
-
55P
-
-
-
-
GND (Bank 2)
-
-
AJ13
BK2_IO47
-
85N
BK2_IO27
-
55N
AG13
BK2_IO48
-
86P
BK2_IO28
-
56P
AH13
BK2_IO49
-
86N
BK2_IO29
-
56N
AE14
BK2_IO50
-
87P
BK2_IO30
-
57P
-
GND (Bank 2)
-
-
-
-
-
AF14
BK2_IO51
-
87N
BK2_IO31
-
57N
AG14
BK2_IO52
-
88P
BK2_IO32
-
58P
AH14
BK2_IO53
-
88N
BK2_IO33
-
58N
AJ14
BK2_IO54
-
89P
BK2_IO34
-
59P
-
-
-
-
GND (Bank 2)
-
-
AK14
BK2_IO55
-
89N
BK2_IO35
-
59N
AE15
BK2_IO56
-
90P
BK2_IO36
-
60P
AF15
BK2_IO57
-
90N
BK2_IO37
-
60N
AG15
BK2_IO58
-
91P
BK2_IO38
-
61P
-
GND (Bank 2)
-
-
-
-
-
AH15
BK2_IO59
-
91N
BK2_IO39
-
61N
AJ15
BK2_IO60
-
92P
BK2_IO40
-
62P
AK15
BK2_IO61
-
92N
BK2_IO41
-
62N
-
GND (Bank 2)
-
-
GND (Bank 2)
-
-
-
GND (Bank 3)
-
-
GND (Bank 3)
-
-
AK16
BK3_IO0
-
93P
BK3_IO0
-
63P
AJ16
BK3_IO1
-
93N
BK3_IO1
-
63N
AH16
BK3_IO2
-
94P
BK3_IO2
-
64P
-
GND (Bank 3)
-
-
-
-
-
AG16
BK3_IO3
-
94N
BK3_IO3
-
64N
AF16
BK3_IO4
-
95P
BK3_IO4
-
65P
AE16
BK3_IO5
-
95N
BK3_IO5
-
65N
AK17
BK3_IO6
-
96P
BK3_IO6
-
66P
-
-
-
-
GND (Bank 3)
-
-
AJ17
BK3_IO7
-
96N
BK3_IO7
-
66N
AH17
BK3_IO8
-
97P
BK3_IO8
-
67P
AG17
BK3_IO9
-
97N
BK3_IO9
-
67N
AF17
BK3_IO10
-
98P
BK3_IO10
-
68P
-
GND (Bank 3)
-
-
-
-
-
AE17
BK3_IO11
-
98N
BK3_IO11
-
68N
AH18
BK3_IO12
-
99P
BK3_IO12
-
69P
AG18
BK3_IO13
-
99N
BK3_IO13
-
69N
ispXPGA Logic Signal Connections: 900-Ball fpBGA (Continued)
900 fpBGA
Ball
LFX1200
LFX500
Signal Name
Second
Function
LVDS Pair/
Polarity
Signal Name
Second
Function
LVDS Pair/
Polarity
相關(guān)PDF資料
PDF描述
LFX1200C-03F900I The ispXPGA architecture
LFX1200C-04F900C The ispXPGA architecture
LFX500C-3F900C Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
LFX1200C-3F900C Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
LFX500C-3F900I Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFX1200C-03F900I 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:The ispXPGA architecture
LFX1200C-03FE680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-03FEN680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 1.25M Gt ispJTAG 1. 8V -3 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-03FEN680C2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200C-04F900C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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