參數(shù)資料
型號(hào): LFECP10E-3FN256I
廠商: Lattice Semiconductor Corporation
文件頁(yè)數(shù): 72/163頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 10.2KLUTS 256FPBGA
標(biāo)準(zhǔn)包裝: 90
系列: ECP
邏輯元件/單元數(shù): 10200
RAM 位總計(jì): 282624
輸入/輸出數(shù): 195
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
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7-3
Revision History
LatticeECP/EC Family Data Sheet
September 2005
02.0
Architecture
sysIO section has been updated.
DC & Switching
Characteristics
Recommended Operating Conditions has been updated with VCCPLL.
DC Electrical Characteristics table has been updated
Removed 5V Tolerant Input Buffer section.
Register-to-Register performance table has been updated (rev. G 0.28).
LatticeECP/EC External Switching Characteristics table has been
updated (rev. G 0.28).
LatticeECP/EC Internal Switching Characteristics table has been
updated (rev. G 0.28).
LatticeECP/EC Family Timing Adders have been updated (rev. G 0.28).
sysCLOCK PLL timing table has been updated (rev. G 0.28)
LatticeECP/EC sysCONFIG Port Timing specification table has been
updated (rev. G 0.28).
Master Clock table has been updated (rev. G 0.28).
JTAG Port Timing specification table has been updated (rev. G 0.28).
Pinout Information
Signal Description table has been updated with VCCPLL.
November 2005
02.1
DC & Switching
Characteristics
Pin-to-Pin Performance table has been updated (G 0.30)
- 4:1MUX, 8:1MUX, 16:1MUX, 32:1MUX
Register-to-Register Performance (G 0.30) - No timing number
changes.
External Switching Characteristics (G 0.30) - No timing number
changes.
Internal Switching Characteristics (G 0.30)
-tSUP_DSP, tHP_DSP, tSUO_DSP, tHO_DSP, tCOI_DSP, tCOD_DSP numbers
have been updated.
Family Timing Adders (G 0.30) - No timing number changes.
sysCLOCK PLL Timing (G 0.30) - No timing number changes.
sysCONFIG Port Timing Specifications (G 0.30) - No timing number
changes.
Master Clock (G 0.30) - No timing number changes.
JTAG Port Timing Specification (G 0.30) - No timing number changes.
Ordering Information
Added 208-PQFP lead-free part numbers.
March 2006
02.2
DC & Switching
Characteristics
Added footnote 3. to VCCAUX in the Recommended Operating Condi-
tions table.
January 2007
02.3
Architecture
EBR Asynchronous Reset section added.
February 2007
02.4
Architecture
Updated EBR Asynchronous Reset section.
Updated Maximum Number of Elements in a Block table - MAC value for
x9 changed to 2.
May 2007
02.5
Architecture
Updated text in Ripple Mode section.
November 2007
02.6
DC & Switching
Characteristics
Added JTAG Port Waveforms diagram.
Updated tRST timing information in the sysCLOCK PLL Timing table.
Pinout Information
Added Thermal Management text section.
Supplemental
Information
Updated title list.
February 2008
02.7
DC & Switching
Characteristics
Read/Write Mode (Normal) and Read/Write Mode with Input and Output
Registers waveforms in the EBR Memory Timing Diagrams section
have been updated.
September 2012
02.8
All
Updated document with new corporate logo.
Date
Version
Section
Change Summary
相關(guān)PDF資料
PDF描述
LFECP10E-4FN256C IC FPGA 10.2KLUTS 195I/O 256-BGA
LFECP10E-3F256I IC FPGA 10.2KLUTS 195I/O 256-BGA
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LFECP10E-3FN484C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10.2K LUTs Pb-Free RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFECP10E-3FN484I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10.2K LUTs 288 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFECP10E-3FN672C 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:LatticeECP/EC Family Data Sheet
LFECP10E-3FN672I 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:LatticeECP/EC Family Data Sheet
LFECP10E-3Q208C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 10.2K LUTs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256