- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369747 > LF5661 Pulsed Power - Describes Dynex＇s Pulsed Power capability PDF資料下載
參數(shù)資料
| 型號(hào)： | LF5661 |
| 英文描述： | Pulsed Power - Describes Dynex＇s Pulsed Power capability |
| 中文描述： | 脈沖功率-介紹Dynex的脈沖功率能力 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 385K |
| 代理商： | LF5661 |
www.dynexsemi.com
7
Module Package Outlines
Diode Package Outlines and Circuit Configurations
All dimensions shown in mm unless stated otherwise.
Module type: MP02
23
23
24
3
3
94
6.5
Nominal weight: 350g
Module type: MP03
35
28.5
92
5.5
3
M8
42.5
Nominal weight: 950g
67 4
M3
hd
50.8
36.6
1
1/4 - 18NPT
Nominal weight: 1800g
31
6
150
112
25.4
6.5(4 plce
M10 Thd
Max. 18dp
3
Module type: MP04-W3A
Circuit type: DD
Nominal weight: 1500g
31
6
52
150
112
M10 Thd
Max. 18dp
Module type: MP04
1
2
3
1
2
3
1
2
3
1
2
3
Circuit type: HB
Circuit type: G
Circuit type: GN
1
2
3
1
2
3
1
2
3
Circuit type: HB
Circuit type: G
Circuit type: GN
1
2
3
1
2
3
1
2
3
Circuit type: HB
Circuit type: G
Circuit type: GN
Module Mounting Recommendations
Adequate heatsinking is
required to maintain the
base temperature at 75
C if
full rated current is to be
achieved. Power dissipation
may be calculated by use of
V
and r
information in
accordance with standard
formulae. Dynex can provide
assistance with calculations
or choice of heatsink if
required.
The heatsink surface must
be smooth and flat; a surface
finish of N6 (32
μ
in) and a
flatness within 0.05mm
(0.002") are recommended.
Immediately
mounting, the heatsink
surface should be lightly
scrubbed with fine emery,
Scotch Brite
chemical etchant and then
cleaned with a solvent to
remove oxide build up and
foreign material. Care
should be taken to ensure no
foreign particles remain.
prior
to
or a mild
An even coating of thermal
compound (eg. Unial) should
be applied to both the
heatsink
and
mounting surfaces. This
should ideally be 0.05mm
(0.002") per surface to
ensure optimum thermal
performance.
module
After application of thermal
compound, place the
module squarely over the
mounting holes, (or
‘
T
’
slots)
in the heatsink. Using a
torque wrench, slowly
tighten the recommended
fixing bolts at each end,
rotating each in turn no more
than 1/4 of a revolution at a
time. Continue until the
required torque of 6Nm
(55lb.ins) is reached at both
ends.
It is not acceptable to fully
tighten one fixing bolt before
starting to tighten the others.
Such action may DAMAGE
the module.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LF580 | LF580 - 12dB/oct Butterworth Analog High Pass Filter |
| LF580MCRO | Analog IC |
| LF580MINI | Analog IC |
| LF580PLID | Analog IC |
| LF9502JC40 | x10 Synchronous FIFO |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LF580 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Dual, Continuous, Analog Highpass Filter |
| LF580MCRO | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| LF580MINI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| LF580PLID | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| LF59EMBGMBC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:T-1 3/4 (5mm) FULL COLOR RGB LED LAMPS |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。