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參數(shù)資料
| 型號(hào)： | LDHT245 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 16-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS |
| 中文描述： | 16位雙電源總線收發(fā)器可配置電壓轉(zhuǎn)換和三態(tài)輸出 |
| 文件頁(yè)數(shù)： | 9/15頁(yè) |
| 文件大?。?/td> | 358K |
| 代理商： | LDHT245 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
TSSOP
Package
Drawing
DGG
Pins Package
Qty
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74LVCH16T245DGGRE4
ACTIVE
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16T245DLG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16T245DLRG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16T245ZQLR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
TSSOP
ZQL
56
SNAGCU
Level-1-260C-UNLIM
SN74LVCH16T245DGGR
ACTIVE
DGG
48
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16T245DGVR
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16T245DL
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16T245DLR
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16T245KR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQL
56
TBD
SNPB
Level-1-240C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
24-Feb-2006
Addendum-Page 1
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