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參數(shù)資料
| 型號(hào)： | LDH374A |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS |
| 中文描述： | 16位邊沿觸發(fā)的D -型觸發(fā)器具有三態(tài)輸出 |
| 文件頁數(shù)： | 8/18頁 |
| 文件大?。?/td> | 386K |
| 代理商： | LDH374A |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
TSSOP
Package
Drawing
DGG
Pins Package
Qty
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74LVCH16374ADGGRG4
ACTIVE
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16374ADGVRE4
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16374ADGVRG4
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16374ADLG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
74LVCH16374ADLRG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16374ADGGR
ACTIVE
TSSOP
DGG
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16374ADGVR
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16374ADL
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16374ADLR
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCH16374AGQLR
NRND
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
GQL
56
TBD
SNPB
Level-1-240C-UNLIM
SN74LVCH16374AZQLR
ACTIVE
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Addendum-Page 1
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