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參數(shù)資料
| 型號(hào)： | LB-20 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Effect of PWB Copper Area on Thermal Performance of 20−Lead SOIC LB Package |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大小： | 70K |
| 代理商： | LB-20 |
For the double-layer copper board, the
copper area on the bottom is identical
to the area on the top. Both the top and
bottom layers are thermally connected
through vias placed on each ground
lead.
Variable Copper Area Test Board
Red-hatched area is copper on the surface of the PWB
The 20 lead LB package has 4 ground
leads as shown. Additional copper
area must be connected to these
leads.
16 15
Thermal Resistance (R
θ
JA
) vs. Copper Area on PWB
Effect of PWB Copper Area on Thermal Performance
of 20
Lead SOIC LB Package
Copper Area Must Be Connected to
Package Ground Leads
Using a Double-Layer PWB
5 6
40
50
60
70
80
90
100
0
1
2
3
4
Area of Copper on Board (in
2
)
T
0
C
One side Copper
Two side Copper
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