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    參數(shù)資料
    型號(hào): L640MU11NI
    廠商: Advanced Micro Devices, Inc.
    元件分類: DRAM
    英文描述: 64 Megabit (4 M x 16-Bit) MirrorBita?? 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/Oa?? Control
    中文描述: 64Mb(4個(gè)M x 16位)的MirrorBit,3V,統(tǒng)一扇區(qū)閃存并有Versatile輸入/輸出控制
    文件頁(yè)數(shù): 6/59頁(yè)
    文件大小: 699K
    代理商: L640MU11NI
    4
    Am29LV640MU
    25301C5 February1,2007
    D A T A S H E E T
    TABLE OF CONTENTS
    MirrorBit 64 Mbit Device Family . . . . . . . . . . . . . . 3
    Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 5
    Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
    Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
    Special Package Handling Instructions ....................................7
    Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
    Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
    Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 9
    Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10
    Table 1. Device Bus Operations .....................................................10
    VersatileIO
    (V
    IO
    ) Control .....................................................10
    Requirements for Reading Array Data ...................................10
    Page Mode Read ....................................................................11
    Writing Commands/Command Sequences ............................11
    Write Buffer .............................................................................11
    Accelerated Program Operation .............................................11
    Autoselect Functions ..............................................................11
    Standby Mode........................................................................ 11
    Automatic Sleep Mode ...........................................................11
    RESET#: Hardware Reset Pin ...............................................12
    Output Disable Mode ..............................................................12
    Table 2. Sector Address Table ........................................................13
    Autoselect Mode..................................................................... 15
    Table 3. Autoselect Codes, (High Voltage Method) .......................15
    Sector Group Protection and Unprotection .............................16
    Table 4. Sector Group Protection/Unprotection AddressTable .....16
    Temporary Sector Group Unprotect .......................................17
    Figure 1. Temporary Sector Group UnprotectOperation................ 17
    Figure 2. In-System Sector Group Protect/UnprotectAlgorithms... 18
    Secured Silicon Sector Flash MemoryRegion .......................19
    Table 5. Secured Silicon Sector Contents ......................................19
    Figure 3. Secured Silicon Sector Protect Verify.............................. 20
    Hardware Data Protection ......................................................20
    Low VCC Write Inhibit ............................................................20
    Write Pulse “Glitch” Protection ...............................................20
    Logical Inhibit ..........................................................................20
    Power-Up Write Inhibit ............................................................20
    Common Flash Memory Interface (CFI). . . . . . . 21
    Table 6. CFI Query Identification String.............................. 21
    Table 7. System Interface String......................................................21
    Table 8. Device Geometry Definition................................... 22
    Table 9. Primary Vendor-Specific Extended Query............. 23
    Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
    Reading Array Data ................................................................24
    Reset Command .....................................................................24
    Autoselect Command Sequence ............................................24
    Enter Secured Silicon Sector/Exit Secured Silicon Sector
    CommandSequence ..............................................................25
    Word Program Command Sequence .....................................25
    Unlock Bypass Command Sequence .....................................25
    Write Buffer Programming ......................................................25
    Accelerated Program ..............................................................26
    Figure 4. Write Buffer Programming Operation............................... 27
    Figure 5. Program Operation.......................................................... 28
    Program Suspend/Program Resume Command Sequence ...28
    Figure 6. Program Suspend/Program Resume............................... 29
    Chip Erase Command Sequence ...........................................29
    Sector Erase Command Sequence ........................................29
    Erase Suspend/Erase Resume Commands ...........................30
    Figure 7. Erase Operation.............................................................. 30
    Command Definitions............................................................. 31
    Table 10. Command Definitions......................................................31
    Write Operation Status. . . . . . . . . . . . . . . . . . . . . 32
    DQ7: Data# Polling .................................................................32
    Figure 8. Data# Polling Algorithm.................................................. 32
    RY/BY#: Ready/Busy#............................................................ 33
    DQ6: Toggle Bit I ....................................................................33
    Figure 9. Toggle Bit Algorithm........................................................ 34
    DQ2: Toggle Bit II ...................................................................34
    Reading Toggle Bits DQ6/DQ2 ...............................................34
    DQ5: Exceeded Timing Limits ................................................35
    DQ3: Sector Erase Timer .......................................................35
    DQ1: Write-to-Buffer Abort .....................................................35
    Table 11. Write Operation Status ...................................................35
    Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 36
    Figure 10. Maximum Negative OvershootWaveform................... 36
    Figure 11. Maximum Positive OvershootWaveform..................... 36
    Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 36
    DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
    Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 38
    Figure 12. Test Setup.................................................................... 38
    Table 12. Test Specifications .........................................................38
    Key to Switching Waveforms. . . . . . . . . . . . . . . . 38
    Figure 13. Input Waveforms and
    Measurement Levels...................................................................... 38
    AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
    Read-Only Operations ...........................................................39
    Figure 14. Read Operation Timings............................................... 39
    Figure 15. Page Read Timings...................................................... 40
    Hardware Reset (RESET#) ....................................................41
    Figure 16. Reset Timings............................................................... 41
    Erase and Program Operations ..............................................42
    Figure 17. Program Operation Timings.......................................... 43
    Figure 18. Accelerated Program Timing Diagram.......................... 43
    Figure 19. Chip/Sector Erase Operation Timings.......................... 44
    Figure 20. Data# Polling Timings
    (During Embedded Algorithms)...................................................... 45
    Figure 21. Toggle Bit Timings
    (During Embedded Algorithms)...................................................... 46
    Figure 22. DQ2 vs. DQ6................................................................. 46
    Temporary Sector Unprotect ..................................................47
    Figure 23. Temporary Sector Group Unprotect TimingDiagram... 47
    Figure 24. Sector Group Protect and Unprotect TimingDiagram.. 48
    Alternate CE# Controlled Erase and ProgramOperations .....49
    Figure 25. Alternate CE# Controlled Write (Erase/Program)
    OperationTimings.......................................................................... 50
    Erase And Programming Performance. . . . . . . . 51
    Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 51
    TSOP Pin and FIne-pitch BGA Package
    Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
    Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
    Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 53
    LAA064—64-Ball Fortified Ball Grid Array (
    F
    BGA)
    13x11mmPackage ..............................................................53
    FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
    12x11mmPackage ..............................................................54
    Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
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