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參數(shù)資料
| 型號(hào)： | L6316 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 4-CHANNEL LOW POWER PREAMPLIFIER |
| 中文描述： | 4通道低功耗前置放大器 |
| 文件頁(yè)數(shù)： | 3/6頁(yè) |
| 文件大?。?/td> | 47K |
| 代理商： | L6316 |
3/6
L6316
Figure 3. Flip Chip Pinout Diagram - BUMPS DOWN
Note: Minimum pad pitch = 204 um and pad opening (octagonal) = 70 um
Bump Sequence (see next table for coordinates)
Die dimensions:
X = 2192 ±20 um
Y = 2686 ±20 um
204um
500 ±20 um
90
±15 um
120 ±15 um
38 um
63% Tin, 37% Lead
96% Tin, 3.5% Silver, 0.5% Copper
Minimum distance between pads opening center to center:
Wafer thickness:
Bump height:
Bump diameter:
Die center misalignment w.r.t original die center after cut:
Bump material if eutectic:
Bump material if lead free:
Note: VREF PAD can be left floating or grounded. DO NOT CONNECT IT ANYWHERE ELSE.
TF
VEE GND VCC
HR3Y
HR3X
HW3Y
HW3X
HW2X
HW2Y
HW1Y
HW1X
HW0X
HW0Y
HR2Y
HR1Y
HR2X
HR1X
SDEN
WDX
WDY
SCLK
RDX
RDY
SDATA
RXW
FLT
VEEGND VREF VCC
HR0Y
HR0X
0,0
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