參數(shù)資料
型號: L6225D
廠商: 意法半導(dǎo)體
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: DUAL DMOS FULL BRIDGE MOTOR DRIVER
中文描述: 雙DMOS全橋電機(jī)驅(qū)動(dòng)
文件頁數(shù): 4/10頁
文件大?。?/td> 90K
代理商: L6225D
L6225
4/10
PIN DESCRIPTION
THERMAL DATA
Name
PowerSO20
PowerDIP20/
SO20
Function
V
SA
2
17
Supply Voltage of the Bridge A.
V
SB
19
14
Supply Voltage of the Bridge B. This pin must be connected to V
SA
.
OUT1
A
OUT2
A
9
3
4
18
Bridge A outputs.
OUT1
B
OUT2
B
12
18
7
13
Bridge B outputs.
SENSE
A
8
3
Sense resistor forthe bridge A
SENSE
B
13
8
Sense resistor forthe bridge B
GND
1,10,11,20
5, 6,15,16
Common ground terminals. In Powerdip and SO packages, these pins are
also used for heat dissipation toward the PCB.
EN
A
5
20
Enable of the Bridge A. A LOW logic level applied to this pin switches off
all the power DMOSs of the related bridge.
The Bridge A over current protection open drain is internally connected to
this pin.
EN
B
16
11
Enable of the Bridge B. A LOW logic level applied to this pin switches off
all the power DMOSs of the related bridge.
The Bridge B over current protection open drain is internally connected to
this pin.
IN1
A
IN2
A
6
7
1
2
Logic inputs of the Bridge B.Provided the ENA signal is HIGH, a HIGH
logic level applied to any of these pins switches on the related high side
power DMOS, while a logic LOW switches on the related low side power
DMOS .
IN1
B
IN2
B
14
15
9
10
Logic inputs of the Bridge B.Provided the ENB signal is HIGH, a HIGH
logic level applied to any of these pins switches on the related high side
power DMOS, while a logic LOW switches on the related low side power
DMOS .
V
CP
4
19
Bootstrap Oscillator. Oscillator output for the external charge pump.
V
BOOT
17
12
Supply voltage to overdrive the upper DMOSs.
Symbol
Description
PowerDIP20
SO20
PowerSO20
Unit
R
th-j-pins
MaximumThermal Resistance Junction-Pins
13
15
-
°
C/W
R
th-j-case
Maximum Thermal Resistance Junction-Case
-
-
2
°
C/W
R
th-j-amb1
MaximumThermal Resistance Junction-Ambient
(1)
(1) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm
2
(with a thickness of 35
μ
m).
(2) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
(with a thickness of 35
μ
m).
(3) Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm
2
(with a thickness of 35
μ
m), 16 via holes
and a ground layer.
(4) Mounted on a multiplayerPCB without any heatsinking surface on the board.
41
51
-
°
C/W
R
th-j-amb1
Maximum Thermal Resistance Junction-Ambient
(2)
-
-
36
°
C/W
R
th-j-amb1
MaximumThermal Resistance Junction-Ambient
(3)
-
-
16
°
C/W
R
th-j-amb2
Maximum Thermal Resistance Junction-Ambient
(4)
57
78
63
°
C/W
相關(guān)PDF資料
PDF描述
L6225N DUAL DMOS FULL BRIDGE MOTOR DRIVER
L6225PD DUAL DMOS FULL BRIDGE MOTOR DRIVER
L6227 DUAL DMOS FULL BRIDGE MOTOR DRIVER
L6227D DUAL DMOS FULL BRIDGE MOTOR DRIVER
L6227N DUAL DMOS FULL BRIDGE MOTOR DRIVER
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