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參數(shù)資料
| 型號(hào)： | KPC120SR104TAH |
| 廠商： | HYPERTRONICS CORP |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 120 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER |
| 文件頁(yè)數(shù)： | 1/6頁(yè) |
| 文件大?。?/td> | 551K |
| 代理商： | KPC120SR104TAH |
Dimensions are in inches [mm]
PC/104+ Series
3 / 105
www.hypertronics.com
PCI-104 Style Architecture,
Stackable Connector System
2mm centerline, 4 X 30 contact grid (120 total
contact positions)
Up to 1 Amp per contact
Insulator material meets NASA outgassing
specifications
Connector designed for ruggedized applications
Contact tails available in square press-fit and round
solder termination styles
System is compatible with industry standard PCI-104
bus as well as proposed NASA SPACE-104 standards
Accommodates both standard and custom PC
board stacking height designs by utilizing multiple
pin carriers and contact tail lengths
General Specifications
Part Reference Number
Stackthrough Variations:
- KPC120SQ060TAH
- KPC120RQ060TAH
- KPC120SR104
Non-Stackthrough Variations
- KPC120NQ060TAH
- KPC120NR060TAH
- KPC120NR104TAH
Design Criteria Basis
PC/104-Plus Specification Version 2.0, November 2003
Contact Mating Diameter
0.016 [0.40]
Current Rating
1 Amp Continuous
Contact Resistance
< 8 milliohoms
Contact Insertion/Extraction Forces
Insertion: 1.28 oz. max.; Extraction: 1 oz. max. per contact
Contact Life Cycle
100,000
Breakdown Voltage Between Contacts
1950 V max.
Operating Voltage
1463 V max
Material and Plating (contacts only)
Socket End: Beryllium copper wires and brass body components;
50in gold over nickel on wires, gold flash over nickel on all other
socket components
Tail (Mating) End: Phosphor bronze; 50in gold over 50in nickel
Shock and Vibration (contacts only)
Vibration testing to MIL-DTL-55302 para. 4.5.10
Shock testing to MIL-DTL-55302 para. 4.5.14
Insulation Resistance
> 5000 megohms at 500 VDC
Insulator Material
30% Glass-filled LCP (meets NASA outgassing specification)
Flammability Rating
UL94-V0
Operating Temperature
-55° C to 125° C
Suggested Printed Circuit Board Mounting Hole Diameter
0.35 ± 0.003 [0.88 ± 0.08]
HYP_08_3rec13.qxd:Layout 1
8/6/08
4:50 PM
Page 105
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