參數(shù)資料
型號： KMPC8541VTAPF
廠商： Freescale Semiconductor
文件頁數(shù)： 14/88頁
文件大?。?/td> 0K
描述： IC MPU POWERQUICC III 783-FCPBGA
標準包裝： 1
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 833MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
MPC8541E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
Freescale Semiconductor
21
Ethernet: Three-Speed, MII Management
7.2
DUART AC Electrical Specifications
Table 17 provides the AC timing parameters for the DUART interface of the MPC8541E.
8
Ethernet: Three-Speed, MII Management
This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII
management.
8.1
Three-Speed Ethernet Controller (TSEC)
(10/100/1000 Mbps)—GMII/MII/TBI/RGMII/RTBI Electrical
Characteristics
The electrical characteristics specified here apply to all GMII (gigabit media independent interface), the
MII (media independent interface), TBI (ten-bit interface), RGMII (reduced gigabit media independent
interface), and RTBI (reduced ten-bit interface) signals except MDIO (management data input/output) and
MDC (management data clock). The RGMII and RTBI interfaces are defined for 2.5 V, while the GMII
and TBI interfaces can be operated at 3.3 V or 2.5 V. Whether the GMII, MII, or TBI interface is operated
at 3.3 or 2.5 V, the timing is compliant with the IEEE 802.3 standard. The RGMII and RTBI interfaces
follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical Layer Device
Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in
8.1.1
TSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 18 and Table 19. The potential applied to the input of a GMII, MII, TBI, RGMII, or
RTBI receiver may exceed the potential of the receiver’s power supply (for example, a GMII driver
powered from a 3.6-V supply driving VOH into a GMII receiver powered from a 2.5-V supply). Tolerance
for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII
and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Table 17. DUART AC Timing Specifications
Parameter
Value
Unit
Notes
Minimum baud rate
fCCB_CLK / 1048576
baud
3
Maximum baud rate
fCCB_CLK / 16
baud
1, 3
Oversample rate
16
—
2, 3
Notes:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start
bit. Subsequent bit values are sampled each 16th sample.
3. Guaranteed by design.
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KMPC8541VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤
KMPC8543EHXANG 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8543EHXAQG 功能描述:微處理器 - MPU PQ38 8548E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8543EVUANG 功能描述:微處理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8543EVUAQG 功能描述:微處理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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