參數資料
型號: KMPC8358EZQAGDGA
廠商: Freescale Semiconductor
文件頁數: 90/95頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 668-PBGA
標準包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 668-BBGA 裸露焊盤
供應商設備封裝: 668-PBGA-PGE(29x29)
包裝: 托盤
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
90
Freescale Semiconductor
System Design Information
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
pin, which is on the periphery of package, without the inductance of vias.
Figure 54 shows the PLL power supply filter circuit.
Figure 54. PLL Power Supply Filter Circuit
24.3
Decoupling Recommendations
Due to large address and data buses as well as high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the device system, and the device itself
requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer
place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pins of the device. These
decoupling capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and GND
power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly
under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
quick response time necessary. They should also be connected to the power and ground planes through two
vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo
OSCON).
24.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high
inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of
the device.
VDD
AVDDn
2.2 F
GND
Low ESL Surface Mount Capacitors
10
Ω
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