參數(shù)資料
型號(hào)： KMPC8347ZUAJF
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 90/99頁(yè)
文件大?。?/td> 0K
描述： IC MPU PWRQUICC II 672-TBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 533MHz
電壓： 1.2V
安裝類型： 表面貼裝
封裝/外殼： 672-LBGA
供應(yīng)商設(shè)備封裝： 672-TBGA（35x35）
包裝： 托盤(pán)
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
90
Freescale Semiconductor
Thermal
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
20.3
Heat Sink Attachment
When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.
The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to
the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the
package from the board. Such peeling forces reduce the solder joint lifetime of the package. The
recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive
attachment should attach to painted or plastic surfaces, and its performance should be verified under the
application requirements.
20.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
RθJC = junction-to-case thermal resistance (°C/W)
PD = power dissipation (W)
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KMPC8347ZUALFB 功能描述:微處理器 - MPU 8349 TBGA W/PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8349CVVAJDB 功能描述:微處理器 - MPU 8349 TBGA NOPB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8349CZUAJDB 功能描述:微處理器 - MPU 8349 TBGA W/O ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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