參數(shù)資料
型號(hào): KMPC8347ECZQAGD
廠商: Freescale Semiconductor
文件頁數(shù): 22/99頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC II 620-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 620-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 620-PBGA(29x29)
包裝: 托盤
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
29
Ethernet: Three-Speed Ethernet, MII Management
8.2.3.1
TBI Transmit AC Timing Specifications
Table 29 provides the TBI transmit AC timing specifications.
Figure 14 shows the TBI transmit AC timing diagram.
Figure 14. TBI Transmit AC Timing Diagram
8.2.3.2
TBI Receive AC Timing Specifications
Table 30 provides the TBI receive AC timing specifications.
Table 29. TBI Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
GTX_CLK clock period
tTTX
—8.0
ns
GTX_CLK duty cycle
tTTXH/tTTX
40
60
%
GTX_CLK to TBI data TXD[7:0], TX_ER, TX_EN delay
tTTKHDX
1.0
5.0
ns
GTX_CLK clock rise (20%–80%)
tTTXR
——
1.0
ns
GTX_CLK clock fall time (80%–20%)
tTTXF
——
1.0
ns
Notes:
1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI transmit
timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid state (V)
or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until
the referenced data signals (D) reach the invalid state (X) or hold time. In general, the clock reference symbol is based on
three letters representing the clock of a particular function. For example, the subscript of tTTX represents the TBI (T) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
Table 30. TBI Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
PMA_RX_CLK clock period
tTRX
16.0
ns
PMA_RX_CLK skew
tSKTRX
7.5
8.5
ns
RX_CLK duty cycle
tTRXH/tTRX
40
60
%
GTX_CLK
TXD[7:0]
tTTX
tTTXH
tTTXR
tTTXF
tTTKHDX
TX_EN
TX_ER
相關(guān)PDF資料
PDF描述
IDT70V3389S5BC8 IC SRAM 1.125MBIT 5NS 256BGA
IDT7006S25G IC SRAM 128KBIT 25NS 68PGA
IDT70V3569S5BF IC SRAM 576KBIT 5NS 208FBGA
IDT70V3379S5BF IC SRAM 576KBIT 5NS 208FBGA
KMPC8343ZQAGD IC MPU PWRQUICC II 620-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8347ECZQAGDB 功能描述:微處理器 - MPU 8347 PBGA ENC W/PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347ECZUAJDB 功能描述:微處理器 - MPU 8349 TBGA W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347EVRAGD 功能描述:IC MPU POWERQUICC II 620-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
KMPC8347EVRAGDB 功能描述:微處理器 - MPU 8347 PBGA NOPB W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8347EVVAGDB 功能描述:微處理器 - MPU 834X TBGA NOPB W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324