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| 型號： | KMPC8313ZQAFFB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 83/99頁 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II 516-PBGA |
| 標準包裝： | 2 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 電壓： | 0.95 V ~ 1.05 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA 裸露焊盤 |
| 供應商設備封裝： | 516-PBGAPGE（27x27） |
| 包裝： | 托盤 |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
84
Freescale Semiconductor
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB PD)
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51–8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
21.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (JT PD)
where:
TJ = junction temperature (C)
TT = thermocouple temperature on top of package (C)
JT = thermal characterization parameter (C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
21.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case
thermal resistance and a case to ambient thermal resistance:
RJA = RJC + RCA
where:
RJA = junction-to-ambient thermal resistance (C/W)
RJC = junction-to-case thermal resistance (C/W)
RCA = case-to- ambient thermal resistance (C/W)
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