參數(shù)資料
型號: KMPC8272ZQTIEA
廠商: Freescale Semiconductor
文件頁數(shù): 59/61頁
文件大?。?/td> 0K
描述: IC MPU PWRQUICC II 32BIT 516PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 400MHz
電壓: 1.5V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應(yīng)商設(shè)備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
Freescale Semiconductor
7
Operating Conditions
PCI bridge
— PCI Specification revision 2.2-compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI to 60x memory and 60x memory to PCI streaming
— PCI host bridge or peripheral capabilities
— Includes four DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes the configuration registers required by the PCI standard (which are automatically
loaded from the EPROM to configure the MPC8272) and message and doorbell registers
— Supports the I2O standard
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic, which uses a buffer pool to allocate buffers for each port
2
Operating Conditions
This table shows the maximum electrical ratings.
Table 3. Absolute Maximum Ratings1
1 Absolute maximum ratings are stress ratings only; functional operation (see Table 4) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
Rating
Symbol
Value
Unit
Core supply voltage2
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V during normal operation. It is recommended that
VDD/VCCSYN should be raised before or simultaneous with VDDH during power-on reset. VDD/VCCSYN may
exceed VDDH by more than 0.4 V during power-on reset for no more than 100 ms.
VDD
–0.3 – 2.25
V
PLL supply voltage2
VCCSYN
–0.3 – 2.25
V
I/O supply voltage3
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should
not exceed VDD/VCCSYN by more than 2.5 V during normal operation.
VDDH
–0.3 – 4.0
V
Input voltage4
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
VIN
GND(–0.3) – 3.6
V
Junction temperature
Tj
120
°C
Storage temperature range
TSTG
(–55) – (+150)
°C
相關(guān)PDF資料
PDF描述
KMPC8272VRTMFA IC MPU PWRQUICC II 32BIT 516PBGA
FMC60DRAI-S734 CONN EDGECARD 120PS .100 R/A SLD
KMPC8272VRTIEA IC MPU PWRQUICC II 32BIT 516PBGA
KMPC8272CZQTIEA IC MPU PWRQUICC II 32BIT 516PBGA
ASM36DREI CONN EDGECARD 72POS .156 EYELET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8272ZQTMFA 功能描述:微處理器 - MPU PQ27E A W/TALITOS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8275CVRMIBA 功能描述:微處理器 - MPU PQ II HIP 7 REV A VR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8275CZQMIBA 功能描述:微處理器 - MPU PQ II HIP 7 REV A ZQ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8275VRMIBA 功能描述:微處理器 - MPU PQ II HIP 7 REV A VR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8275ZQMIBA 功能描述:微處理器 - MPU PQ II HIP 7 REV A ZQ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324