參數(shù)資料
型號: KMPC8245LVV300D
廠商: Freescale Semiconductor
文件頁數(shù): 55/68頁
文件大?。?/td> 0K
描述: IC MPU 32BIT 300MHZ 352-TBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 300MHz
電壓: 1.9V
安裝類型: 表面貼裝
封裝/外殼: 352-LBGA
供應(yīng)商設(shè)備封裝: 352-TBGA(35x35)
包裝: 托盤
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
59
Document Revision History
0.4
Section 1.2—Changed Features list (format) to match with the features list of the MPC8245 Integrated
Processor Reference Manual.
Section 1.4.1.2—Updated Table 2 to include 1.8 ± 100mV numbers.
Section 1.4.3—Changed Table 7 to include new part offerings of 333 and 350 MHz. Added rows to
include VCO frequency ranges for all parts for both memory VCO and CPU VCO.
Section 1.4.1.5—Updated power consumption table to include 1.8 V (VDD) and higher frequency
numbers.
Section 1.4.3—Updated Table 7 to include higher frequency offerings and CPU VCO frequency range.
Section 1.4.3.1—Changed lettering to caps for DLL_EXTEND and DLL_MAX_DELAY in graph
description section.
Section 1.4.3.2—Changed name of item 11 from Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN Time to
Tos—SDRAM_SYNC_IN to sys_logic_clk Offset Time. Changed name to Tos in Note 7 as well.
Section 1.6—Updated notes in Table 17. Included minimum and maximum VCO numbers for memory
VCO. Changed Note 13 for location of PLL_CFG[0:4] to correct bits location. Bits 7–4 of register offset
<0xE2>. Added Table 18 to cover PLL configuration of higher frequency part offerings.
Section: 1.7—Changed frequency ranges for reference numbers 0, 9, 10, and 17, for the 300-MHz part
to include the higher memory bus frequencies when operating at lower CPU bus frequencies. Added
Table 18 to include PLL configurations for the 333 MHz and the 350 MHz CPU part offerings. Added
VCO multipliers in Tables 17 and 18.
Section 1.7.8—Changed Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN Time to Tos—SDRAM_
SYNC_IN to sys_logic_clk Offset Time.”
Section 1.7.10—Added vendor (Cool Innovations, Inc.) to list of heat sink vendors.
0.3
Section 1.4.1.5—Changed Max-FP value for 33/133/266 of Table 5 from 2.3 to 2.1 watts to represent
characterization data. Changed Note 4 to say VDD = 2.1 for power measurements (for 2-V part).
Changed numbers for maximum I/O power supplies for OVDD and GVDD to represent characterization
data.
Section 1.4.3.1—Added four graphs (Figures 5–8) and description for DLL Locking Range vs.
Frequency of Operation to replace Figure 5 of Rev 0.2 document.
Section 1.4.3.2—Added row (item 11: Tsu—SDRAM_SYNC_IN to PCI_SYNC_IN timing) to Table 9 to
include offset change requirement.
Section 1.5.3—Changed Note 4 of PLL_CFG pins in Table 16 to Note 20.
Section 1.7.2—Added diode (MUR420) to Figure 27, Voltage Sequencing Circuit, to compensate for
voltage extremes in design.
Section 1.7.5—Added sentence with regards to SDRAM_SYNC_IN to PCI_SYNC_IN timing
requirement (Tsu) as a connection recommendation.
Section 1.7.8—Mention of Tsu offset timing and driver capability differences between the MPC8240
and the MPC8245.
Table 19. Revision History Table (continued)
Revision
Date
Substantive Change(s)
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