參數(shù)資料
型號: KMC7457RX1267LC
廠商: Freescale Semiconductor
文件頁數(shù): 7/71頁
文件大?。?/td> 0K
描述: IC MPU RISC 32BIT 1267MHZ 483BGA
標準包裝: 1
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 1.267GHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 483-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 483-FCCBGA(29x29)
包裝: 托盤
Electrical and Thermal Characteristics
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
15
Table 6 provides the DC electrical characteristics for the MPC7457.
Coefficient of thermal expansion
6.8
ppm/°C
Notes:
1. Refer to Section 9.8, “Thermal Management Information,for more details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 6. DC Electrical Specifications
At recommended operating conditions. See Table 4.
Characteristic
Nominal
Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs including SYSCLK)
1.5
VIH
GVDD × 0.65
GVDD + 0.3
V
2
1.8
OVDD/GVDD × 0.65
OVDD/GVDD + 0.3
V
2.5
1.7
OVDD/GVDD + 0.3
V
Input low voltage
(all inputs including SYSCLK)
1.5
VIL
–0.3
GVDD × 0.35
V
2, 6
1.8
–0.3
OVDD/GVDD × 0.35
V
2.5
–0.3
0.7
V
Input leakage current, Vin = GVDD/OVDD
—Iin
—30
A
2, 3
High-impedance (off-state) leakage
current, Vin = GVDD/OVDD
—ITSI
30
A
2, 3, 4
Output high voltage, IOH = –5 mA
1.5
VOH
OVDD/GVDD – 0.45
V
6
1.8
OVDD/GVDD – 0.45
V
2.5
1.8
V
Output low voltage, IOL = 5 mA
1.5
VOL
—0.45
V
6
1.8
0.45
V
2.5
0.6
V
Table 5. Package Thermal Characteristics 1
(continued)
Characteristic
Symbol
Value
Unit
Notes
MPC7447
MPC7457
相關(guān)PDF資料
PDF描述
IDT7027L35PF IC SRAM 512KBIT 35NS 100TQFP
IDT7027L25PF IC SRAM 512KBIT 25NS 100TQFP
KMC7457RX1000NC IC MPU RISC 32BIT 1000MHZ 483BGA
IDT7027L20PF IC SRAM 512KBIT 20NS 100TQFP
FMC65DRYI-S13 CONN EDGECARD 130POS .100 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMC7457VG1000NC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC7457VG1267LC 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC755CPX350LE 功能描述:微處理器 - MPU 360PBGA RV2.8 6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC755CRX350TE 功能描述:微處理器 - MPU 360CBGA RV2.8 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC755CVT400LE 功能描述:微處理器 - MPU GF RV2.8 4A 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324