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參數(shù)資料
| 型號： | KMC7448VU1700LC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 43/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 128BIT 1700MHZ 360-FCCBGA |
| 標準包裝： | 1 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 1.7GHz |
| 電壓： | 1.3V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-CBGA，F(xiàn)CCBGA |
| 供應商設備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
48
Freescale Semiconductor
System Design Information
9.7.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 5, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 24 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 24. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and, finally, to the heat sink, where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
9.7.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 25 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, fluoroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 22). Therefore, synthetic grease offers the best thermal performance due to the low interface
pressure and is recommended due to the high power dissipation of the MPC7448. Of course, the selection
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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| KMC7457RX1267LC | 功能描述:微處理器 - MPU APOLO7 RV1.2 SAMPLE PRT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KMC7457VG1000NC | 功能描述:微處理器 - MPU APOLO7 RV1.2 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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