參數(shù)資料
型號(hào)： KMC7448VS1400NC
廠商： Freescale Semiconductor
文件頁數(shù)： 41/60頁
文件大小： 0K
描述： IC MPU 128BIT 1400MHZ 360-FCCLGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC74xx
處理器類型： 32-位 MPC74xx PowerPC
速度： 1.4GHz
電壓： 1.15V
安裝類型： 表面貼裝
封裝/外殼： 360-CLGA，F(xiàn)CCLGA
供應(yīng)商設(shè)備封裝： 360-FCCLGA（25x25）
包裝： 托盤
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
46
Freescale Semiconductor
System Design Information
9.7
Power and Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7448 implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see Section 9.7.5.1,
“Power Consumption with DFS Enabled,” for specific information regarding power reduction and DFS.
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 9.7.4, “Temperature Diode,” for more
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see Figure 22); however, due to the potential large mass of the heat sink, attachment through the
printed-circuit board is suggested. In any implementation of a heat sink solution, the force on the die
should not exceed ten pounds (45 Newtons).
Figure 22. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
NOTE
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in Figure 23.
Thermal
Heat Sink
HCTE BGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
相關(guān)PDF資料
PDF描述
AMC36DTEI CONN EDGECARD 72POS .100 EYELET
FMC65DRYN-S13 CONN EDGECARD 130POS .100 EXTEND
KMC7448HX1700LC IC MPU 128BIT 1700MHZ 360-FCCBGA
65801-011LF CONN RCPT 11POS 2.54MM VERT TIN
FMC65DRYH-S13 CONN EDGECARD 130POS .100 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMC7448VS1400ND 功能描述:微處理器 - MPU APL8 RV2.2.1 1.15V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC7448VS1700LC 功能描述:IC MPU 128BIT 1700MHZ 360-FCCLGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤
KMC7448VS1700LD 功能描述:微處理器 - MPU APL8 RV2.2.1 1.3V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC7448VU1267ND 功能描述:微處理器 - MPU APL8 RV2.2.1 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMC7448VU1400NC 功能描述:IC MPU 128BIT 1400MHZ 360-FCCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*