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參數(shù)資料
| 型號： | KIT33794DWBEVM |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 15/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | KIT EVAL FOR MC33794 EFS SYSTEM |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 其它名稱： | KIT33794DHEVM KIT33794DHEVM-ND |
Sensors
6
Freescale Semiconductor
MC33794
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Peak VPWR Voltage
VPWRPK
40
V
Double Battery
1 Minute Maximum TA = 30°C
VDBLBAT
26.5
V
ESD Voltage
Human Body Model (1)
Machine Model (2)
VESD1
VESD2
±2000
±200
V
Storage Temperature
TSTG
-55 to 150
°C
Operating Ambient Temperature
TA
-40 to 85
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Thermal Resistance
Junction-to-Ambient (3)
Junction-to-Case (4)
Junction-to-Board (5)
RθJA
RθJC
RθJB
41
0.2
3.0
°C/W
Lead Soldering Temperature (for 10 Seconds)
TSOLDER
260
°C
Notes
1.
ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
2.
ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
3.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
4.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
5.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
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