參數(shù)資料
型號: K6F2008T2E
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 256Kx8 bit Super Low Power and Low Voltage Full CMOS Static RAM
中文描述: 256Kx8位超低功耗和低電壓的CMOS靜態(tài)RAM全
文件頁數(shù): 4/9頁
文件大?。?/td> 134K
代理商: K6F2008T2E
Revision 0.0
June 2003
K6F2008T2E Family
4
CMOS SRAM
Preliminary
RECOMMENDED DC OPERATING CONDITIONS
1)
Note:
1. Industrial Product: T
A
=-40 to 85
°
C, unless otherwise specified.
2. Overshoot: Vcc+2.0V in case of pulse width
20ns.
3. Undershoot: -2.0V in case of pulse width
20ns.
4. Overshoot and undershoot are sampled, not 100% tested.
Item
Symbol
Min
Typ.
3.0/3.3
Max
Unit
Supply voltage
Vcc
2.7
3.6
V
Ground
Vss
0
0
0
V
Input high voltage
V
IH
2.2
-
Vcc+0.2
2)
0.6
V
Input low voltage
V
IL
-0.2
3)
-
V
CAPACITANCE
1)
(f=1MHz, T
A
=25
°
C)
1. Capacitance is sampled, not 100% tested
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
C
IN
V
IN
=0V
-
8
pF
Input/Output capacitance
C
IO
V
IO
=0V
-
10
pF
DC AND OPERATING CHARACTERISTICS
1. Typical value are measured at V
CC
=3.0V, T
A
=25
°
C, and not 100% tested.
Item
Symbol
Test Conditions
Min
Typ
1)
Max
Unit
Input leakage current
I
LI
V
IN
=Vss to Vcc
-1
-
1
μ
A
μ
A
Output leakage current
I
LO
CS
1
=V
IH
or CS
2
=V
IL
or
OE=V
IH
or
WE=V
IL,
V
IO
=Vss to Vcc
-1
-
1
Average operating current
I
CC1
Cycle time=1
μ
s, 100% duty, I
IO
=0mA, CS
1
0.2V,
CS
2
V
CC
-0.2V, V
IN
0.2V or V
IN
V
CC
-0.2V
-
-
3
mA
I
CC2
Cycle time=Min, 100% duty, I
IO
=0mA, CS
1
=V
IL
,
CS
2
=V
IH
, V
IN
=V
IL
or V
IH
-
-
35
mA
Output low voltage
V
OL
I
OL
=2.1mA
-
-
0.4
V
Output high voltage
V
OH
I
OH
=-1.0mA
2.4
-
-
V
Standby Current(CMOS)
I
SB1
Other inputs=Vss to Vcc
1) CS
1
Vcc-0.2V, CS2
Vcc-0.2V(CS
1
controlled) or
2) 0V
CS
2
0.2V CS
2
controlled)
-
0.5
10
μ
A
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