參數(shù)資料
型號: K4R441869A-N(M)CK7
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
中文描述: 256 × 16/18位× 2 * 16屬銀行直接RDRAMTM
文件頁數(shù): 63/64頁
文件大?。?/td> 4052K
代理商: K4R441869A-N(M)CK7
Page 61
Direct RDRAM
K4R271669A/K4R441869A
Rev. 1.02 Jan. 2000
Table Of Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Timing Parameters/Part Numbers . . . . . . . . . . . 1
Pinouts and Definitions . . . . . . . . . . . . . . . . . . . . . . . 2
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packet Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-7
Field Encoding Summary. . . . . . . . . . . . . . . . . . . . .8-9
DQ Packet Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10
COLM Packet to D Packet Mapping . . . . . . . . . .10-11
ROW-to-ROW Packet Interaction . . . . . . . . . . . .12-13
ROW-to-COL Packet Interaction . . . . . . . . . . . . . . . 13
COL-to-COL Packet Interaction. . . . . . . . . . . . . . . . 14
COL-to-ROW Packet Interaction . . . . . . . . . . . . . . . 15
ROW-to-ROW Examples . . . . . . . . . . . . . . . . . . .16-17
Row and Column Cycle Description . . . . . . . . . . . . 17
Precharge Mechanisms . . . . . . . . . . . . . . . . . . . .18-19
Read Transaction - Example . . . . . . . . . . . . . . . . . . 20
Write Transaction - Example . . . . . . . . . . . . . . . . . . 21
Write/Retire - Examples. . . . . . . . . . . . . . . . . . . 22-23
Interleaved Write - Example. . . . . . . . . . . . . . . . . . . 24
Interleaved Read - Example . . . . . . . . . . . . . . . .24-25
Interleaved RRWW . . . . . . . . . . . . . . . . . . . . . . .24-25
Control Register Transactions . . . . . . . . . . . . . . . . . 26
Control Register Packets . . . . . . . . . . . . . . . . . . . . . 27
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28-30
Control Register Summary. . . . . . . . . . . . . . . . . 30-37
Power State Management . . . . . . . . . . . . . . . . . 38-41
Refresh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Current and Temperature Control . . . . . . . . . . . . . . 43
Electrical Conditions . . . . . . . . . . . . . . . . . . . . . . . . 44
Timing Conditions . . . . . . . . . . . . . . . . . . . . . . . .44-45
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . 46
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . 46
RSL Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
RSL - Receive Timing . . . . . . . . . . . . . . . . . . . . . . . 48
RSL - Transmit Timing. . . . . . . . . . . . . . . . . . . . . . . 49
CMOS - Receive Timing . . . . . . . . . . . . . . . . . . .50-51
CMOS - Transmit Timing . . . . . . . . . . . . . . . . . . .52-53
RSL - Domain Crossing Window . . . . . . . . . . . . . . . 53
Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . 54
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . 55
IDD - Supply Current Profile . . . . . . . . . . . . . . . . . . 55
Capacitance and Inductance . . . . . . . . . . . . . . . .56-57
Center-Bonded uBGA Package. . . . . . . . . . . . . . . . 58
Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . .59-60
Copyright January 2000 Samsung Electronics.
All rights reserved.
Direct Rambus and Direct RDRAM are trademarks of
Rambus Inc. Rambus, RDRAM, and the Rambus Logo are
registered trademarks of Rambus Inc.
This document contains advanced information that is subject
to change by Samsung without notice.
Document Version 1.02
Samsung Electronics Co., Ltd.
San #24 Nongseo-Ri, Kiheung-Eup Yongin-City
Kyunggi-Do, KOREA
Telephone: 82-331-209-4519
Fax: 82-2-760-7990
http://www.samsungsemi.com
相關(guān)PDF資料
PDF描述
K4R441869A-N(M)CK8 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-N(M)CK8 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-Nb(M)CcG6 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669B-NCG6 256K x 16/18 bit x 32s banks Direct RDRAMTM
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4R441869A-NMCK8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R441869B 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 32s banks Direct RDRAMTM
K4R441869B-MCG6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 32s banks Direct RDRAMTM
K4R441869B-MCK7 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 32s banks Direct RDRAMTM
K4R441869B-MCK8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 32s banks Direct RDRAMTM