參數(shù)資料
型號: K4R271669B-Nb(M)CcK8
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 256K x 16/18 bit x 32s banks Direct RDRAMTM
中文描述: 256 × 16/18位× 32秒銀行直接RDRAMTM
文件頁數(shù): 19/20頁
文件大?。?/td> 306K
代理商: K4R271669B-NB(M)CCK8
Direct RDRAM
Page 17
K4R271669B/K4R441869B
Version 1.11 Oct. 2000
Capacitance and Inductance
Table 17: RSL Pin Parasitics
Symbol
Parameter and Conditions - RSL pins
Min
Max
Unit
Figure
L
I
RSL effective input inductance
4.0
nH
Figure 62
L
12
Mutual inductance between any DQA or DQB RSL signals.
0.2
nH
Figure 62
Mutual inductance between any ROW or COL RSL signals.
0.6
nH
L
I
Difference in L
I
value between any RSL pins of a single device.
-
1.8
nH
Figure 62
C
I
RSL effective input capacitance
a
800
2.0
2.4
pF
Figure 62
711
2.0
2.4
600
2.0
2.6
C
12
Mutual capacitance between any RSL signals.
-
0.1
pF
Figure 62
C
I
Difference in C
I
value between average of {CTM, CTMN, CFM,
CFMN} and any RSL pins of a single device.
-
0.06
pF
Figure 62
R
I
RSL effective input resistance
4
15
Figure 62
a. This value is a combination of the device IO circuitry and package capacitances measured at VDD=2.5V and f=400MHz with pin biased at 1.4V.
Table 18: CMOS Pin Parasitics
Symbol
Parameter and Conditions - CMOS pins
Min
Max
Unit
Figure
L
I ,CMOS
CMOS effective input inductance
8.0
nH
Figure 62
C
I ,CMOS
CMOS effective input capacitance (SCK,CMD)
a
1.7
2.1
pF
C
I ,CMOS,SIO
CMOS effective input capacitance (SIO1, SIO0)
a
-
7.0
pF
a. This value is a combination of the device IO circuitry and package capacitances.
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