參數(shù)資料
型號(hào): K4R271669A
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
中文描述: 256 × 16/18位× 2 * 16屬銀行直接RDRAMTM
文件頁數(shù): 27/64頁
文件大?。?/td> 4052K
代理商: K4R271669A
Page 25
Direct RDRAM
K4R271669A/K4R441869A
Rev. 1.02 Jan. 2000
The second bubble type t
CBUB2
is inserted (as a NOCOP
command) by the controller between a WR and RD
command on the COL pins when there is a WR-WR-RD
sequence to the same device. This bubble enables write data
to be retired from the write buffer without being lost, and is
explained in detail in Figure 18. There would be no bubble if
address c0 and address d0 were directed to different devices.
This bubble appears on the DQA and DQB pins as t
DBUB2
between a write data dualoct D and read data dualoct Q. This
bubble also appears on the ROW pins as t
RBUB2
.
Figure 21: Interleaved Read Transaction with Two Dualoct Data Length
CTM/CFM
DQA8..0
DQB8..0
COL4
..COL0
ROW2
..ROW0
T
0
T
4
T
8
T
12
T
1
T
5
T
9
T
13
T
2
T
6
T
10
T
14
T
3
T
7
T
11
T
15
T
16
T
20
T
24
T
28
T
17
T
21
T
25
T
29
T
18
T
22
T
26
T
30
T
19
T
23
T
27
T
31
T
32
T
36
T
40
T
44
T
33
T
37
T
41
T
45
T
34
T
38
T
42
T
46
T
35
T
39
T
43
T
47
ACT a0
PREX b3
RD c2
RD c1
RD b1
RD b2
PREX a3
ACT b0
ACT c0
ACT d0
ACT e0
RD a1
RD a2
PREX z3
RD d1
ACT f0
RDd2
PREX c3
RD e1
RD e2
PREX d3
RD z1
RD z2
PREX y3
Q (b2)
Q (b1)
Q (a2)
Q (a1)
Q (c1)
Q (c2)
Q (d1)
Q (z2)
Q (z1)
Q (x2)
Q (y1)
Q (y2)
t
RCD
t
CAC
Transaction e can use the
same bank as transaction a
t
RC
t
RR
f3 = {Da,Ba+2}
Transaction f: RD
f0 = {Da,Ba+2,Rf}
f1 = {Da,Ba+2,Cf1}
f2= {Da,Ba+2,Cf2}
e3 = {Da,Ba}
Transaction e: RD
e0 = {Da,Ba,Re}
e1 = {Da,Ba,Ce1}
e2= {Da,Ba,Ce2}
d3 = {Da,Ba+6}
Transaction d: RD
d0 = {Da,Ba+6,Rd}
d1 = {Da,Ba+6,Cd1}
d2= {Da,Ba+6,Cd2}
c3 = {Da,Ba+4}
Transaction c: RD
c0 = {Da,Ba+4,Rc}
c1 = {Da,Ba+4,Cc1}
c2= {Da,Ba+4,Cc2}
b3 = {Da,Ba+2}
Transaction b: RD
b0 = {Da,Ba+2,Rb}
b1 = {Da,Ba+2,Cb1}
b2= {Da,Ba+2,Cb2}
a3 = {Da,Ba}
Transaction a: RD
a0 = {Da,Ba,Ra}
a1 = {Da,Ba,Ca1}
a2= {Da,Ba,Ca2}
z3 = {Da,Ba+6}
Transaction z: RD
z0 = {Da,Ba+6,Rz}
z1 = {Da,Ba+6,Cz1}
z2= {Da,Ba+6,Cz2}
y3 = {Da,Ba+4}
Transaction y: RD
y0 = {Da,Ba+4,Ry}
y1 = {Da,Ba+4,Cy1}
y2= {Da,Ba+4,Cy2}
Figure 22: Interleaved RRWW Sequence with Two Dualoct Data Length
CTM/CFM
DQA8..0
DQB8..0
COL4
..COL0
ROW2
..ROW0
T
0
T
4
T
8
T
12
T
1
T
5
T
9
T
13
T
2
T
6
T
10
T
14
T
3
T
7
T
11
T
15
T
16
T
20
T
24
T
28
T
17
T
21
T
25
T
29
T
18
T
22
T
26
T
30
T
19
T
23
T
27
T
31
T
32
T
36
T
40
T
44
T
33
T
37
T
41
T
45
T
34
T
38
T
42
T
46
T
35
T
39
T
43
T
47
ACT a0
MSK (b2)
WRA c2
MSK (b1)
WR c1
WR b1
MSK (y2)
WRA b2
PREX a3
D (b2)
D (b1)
ACT b0
ACT c0
ACT d0
ACT e0
RD a1
RD a2
PREX z3
Q (a2)
Q (a1)
MSK (c1)
D (c1)
NOCOP
MSK (c2)
RDd0
D (c2)
t
RBUB1
RDf1
Q (z2)
Q (z1)
D (y2)
RD z1
RD z2
t
CBUB1
t
DBUB1
t
DBUB1
t
DBUB2
t
CBUB2
t
RBUB2
t
CBUB2
NOCOP
Transaction e can use the
same bank as transaction a
f3 = {Da,Ba+2}
Transaction f: WR
f0 = {Da,Ba+2,Rf}
f1 = {Da,Ba+2,Cf1}
f2= {Da,Ba+2,Cf2}
e3 = {Da,Ba}
Transaction e: RD
e0 = {Da,Ba,Re}
e1 = {Da,Ba,Ce1}
e2= {Da,Ba,Ce2}
d3 = {Da,Ba+6}
Transaction d: RD
d0 = {Da,Ba+6,Rd}
d1 = {Da,Ba+6,Cd1}
d2= {Da,Ba+6,Cd2}
c3 = {Da,Ba+4}
Transaction c: WR
c0 = {Da,Ba+4,Rc}
c1 = {Da,Ba+4,Cc1}
c2= {Da,Ba+4,Cc2}
b3 = {Da,Ba+2}
Transaction b: WR
b0 = {Da,Ba+2,Rb}
b1 = {Da,Ba+2,Cb1}
b2= {Da,Ba+2,Cb2}
a3 = {Da,Ba}
Transaction a: RD
a0 = {Da,Ba,Ra}
a1 = {Da,Ba,Ca1}
a2= {Da,Ba,Ca2}
z3 = {Da,Ba+6}
Transaction z: RD
z0 = {Da,Ba+6,Rz}
z1 = {Da,Ba+6,Cz1}
z2= {Da,Ba+6,Cz2}
y3 = {Da,Ba+4}
Transaction y: WR
y0 = {Da,Ba+4,Ry}
y1 = {Da,Ba+4,Cy1}
y2= {Da,Ba+4,Cy2}
相關(guān)PDF資料
PDF描述
K4R271669A-N(M)CK7 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R441869A 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R441869A-N(M)CG6 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R441869A-N(M)CK7 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R441869A-N(M)CK8 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4R271669A-N(M)CK7 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-N(M)CK8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-NB(M)CCG6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-NMCG6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A-NMCK7 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM