參數(shù)資料
    型號: JANTX1N3026UR-1
    廠商: Microsemi Corporation
    元件分類: 參考電壓二極管
    英文描述: surface mount silicon Zener diodes
    中文描述: 表面貼裝硅穩(wěn)壓二極管
    文件頁數(shù): 1/3頁
    文件大小: 196K
    代理商: JANTX1N3026UR-1
    1 WATT METAL CASE ZENER DIODES
    SCOTTSDALE DIVISION
    1N3016B thru 1N3051B
    W
    M
    .
    C
    1
    DESCRIPTION
    APPEARANCE
    This well established zener diode series for the 1N3016 thru 1N3051
    JEDEC registration in the metal case DO-13 package provides a glass
    hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability
    applications where it is available in JAN, JANTX, and JANTXV military
    qualifications. Lower voltages are also available in the 1N3821 thru
    1N3830 series (3.3 V to 7.5 V) in the same package (see separate data
    sheet). Microsemi also offers numerous other Zener diode products for a
    variety of other packages including surface mount.
    DO-13
    IMPORTANT:
    For the most current data, consult
    MICROSEMI’s
    website:
    http://www.microsemi.com
    FEATURES
    APPLICATIONS / BENEFITS
    Zener Voltage Range: 6.8V to 200V
    Hermetically sealed DO-13 metal package
    Internally solder-bonded construction.
    Also available in JAN, JANTX, JANTXV
    qualifications per MIL-PRF19500/115 by adding the
    JAN, JANTX, or JANTXV prefixes to part numbers
    for desired level of screening, e.g. JANTX1N3016B,
    JANTXV1N3051B, etc.
    Surface mount also available with 1N3016BUR-1
    thru 1N3051BUR-1 series on separate data sheet
    Regulates voltage over a broad operating current
    and temperature range
    Wide selection from 6.8 to 200 V
    Tight voltage tolerances available
    Low reverse (leakage) currents
    Nonsensitive to ESD
    Hermetically sealed metal package
    Inherently radiation hard as described in Microsemi
    MicroNote 050
    MAXIMUM RATINGS
    MECHANICAL AND PACKAGING
    -65
    o
    C to +175
    o
    C
    THERMAL RESISTANCE: 50
    o
    C/W* junction to lead
    at 0.375 inches (10 mm) from body or 110
    C/W
    junction to ambient when leads are mounted on FR4
    PC board with 4 mm
    copper pads (1 oz) and track
    width 1 mm, length 25 mm
    DC Power Dissipation
    *
    : 1.0 Watt at T
    L
    < +125
    o
    C 3/8”
    (10 mm) from body or 1.0 Watts at T
    L
    < +65
    C when
    mounted on FR4 PC board as described for thermal
    resistance above (also see Fig 1)
    Forward Voltage @ 200 mA: 1.5 Volts.
    Solder Temperatures: 260
    o
    C for 10 s (maximum)
    * For further mounting reference, thermal resistance from junction to metal case may be reduced to
    <
    20
    o
    C/W
    when mounting DO-13 metal case directly on heat sink.
    Operating Junction and Storage Temperatures:
    CASE: DO-13 (DO-202AA), welded, hermetically
    sealed metal and glass
    FINISH: All external surfaces are Tin-Lead (Pb/Sn)
    plated and solderable per MIL-STD-750 method
    2026
    POLARITY: Cathode connected case.
    WEIGHT: 1.4 grams.
    Tape & Reel option: Standard per EIA-296 (add
    “TR” suffix to part number)
    See package dimensions on last page
    Microsemi
    Scottsdale Division
    8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
    Page 1
    Copyright
    2003
    11-03-2003 REV A
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